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- W4247710400 abstract "Modelling of diffusion bonding has been carried out to quantify the kinetics of the bonding processes and to predict the time for achieving a sound bond. An alternative geometric assumption for the shape of the interfacial cavities to those considered previously was employed. Three subprocesses of bonding were introduced to simplify the modelling. These involved volume and interfacial diffusion coupled with creep, rigid collapse, and surface diffusion. The effects of grain size and phase ratio on diffusion bonding have also been considered. The predictions are compared with existing experimental data for copper and Ti–6Al–4V alloy and in general show good agreement.MST/588" @default.
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- W4247710400 date "1987-11-01" @default.
- W4247710400 modified "2023-09-29" @default.
- W4247710400 title "Modelling of diffusion bonding of metals" @default.
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- W4247710400 doi "https://doi.org/10.1179/026708387790221035" @default.
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