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- W4248620750 abstract "In this work, the kinetics of Pb evaporating from Pb-Sn alloy has been investigated. The experiments were performed in the temperature range 1200 K–1400 K and the pressure of 10 Pa. The results indicated that the evaporation of Pb follow first order kinetics. The overall mass transfer coefficients of lead evaporation from Pb-Sn alloy are 2.68 × 10−6 m s−1, 5.01 × 10−6 m s−1 and 1.92 × 10−5 m s−1 at 1200 K, 1300 K and 1400 K, respectively. Additionally, the apparent activation energy of lead evaporation from molten Pb-Sn alloy was calculated. It revealed that the mass transfer of lead in the vapor phase is not rate limiting in the vacuum distillation. The Pb evaporation from Pb-Sn alloy was mix-controlled by vaporization and liquid mass transfer. The mass transfer in the liquid phase is a major rate-limiting step under the present experimental conditions." @default.
- W4248620750 created "2022-05-12" @default.
- W4248620750 date "1991-01-01" @default.
- W4248620750 modified "2023-10-18" @default.
- W4248620750 title "The impact of packaging on the reliability of flip-chip solder bonded devices" @default.
- W4248620750 doi "https://doi.org/10.1016/0026-2714(91)90140-3" @default.
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