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- W4249957795 abstract "The thermal degradation of graphite and glass-reinforced phenolic insulators have been studied at high temperature by using thermogravimetry analysis (TGA) and Differential Scanning Calorimetry (DSC) analysis. TGA was carried out in a stream of pure nitrogen over temperature range ambient to 900°C and DSC analysis to 500°C. A heating rate of 10°C/min was used for the determination of degradation temperature and heating rates of 5, 10, 20, 30, and 50°C/min were used for the estimation of degradation temperature (Tmax) of the insulator at high temperature service and calculation of activation. Activation energy of phenolic resin was calculated as 356 kJ mol−1 using the Ozawa method. Tmax was determined as 661°C for 20% conversion. The specific heat capacity of graphite phenolic was found as 970 J kg−1 K−1 at 100°C. The half-life of the phenolic resin was determined to be approximately 116.2 s at 3500°C. The thermal analysis has been conducted using transient heat conduction and the in-depth temperature distribution was evaluated along the rocket nozzle. The better insulator thickness, including the safety factor for graphite and E-glass-reinforced phenolics, were calculated as 3 and 2 mm, respectively. © 1998 John Wiley & Sons, Inc. J Appl Polym Sci 67:1877–1883, 1998" @default.
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- W4249957795 date "1998-03-14" @default.
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- W4249957795 title "High‐temperature degradation of reinforced phenolic insulator" @default.
- W4249957795 doi "https://doi.org/10.1002/(sici)1097-4628(19980314)67:11<1877::aid-app6>3.3.co;2-y" @default.
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