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- W4250147404 abstract "Wafer bonding allows heterogeneous integration of two materials with similar or very different lattice parameters and thermal properties, via an intermediate bonding layer or direct contact. One of its most prominent applications is silicon-on-insulator (SOI) [1], and it can also be extended to germanium-on-insulator (GOI) or other III-V materials integration. SOI fabricated from wafer bonding is gaining ground from the conventional Si substrate in ultra-large scale integrations (ULSI) and micro-electro-mechanical systems (MEMS) as the starting substrate [2], which benefits from its on-insulator structure. The on-insulator advantages make it possible to attain mechanical stability close to Si substrate and excellent electrostatic control. However, the advantages of SOI are degraded due to the presence of a conventional SiO2 insulator layer with thermal conductivity of ~1.4 Wm-1K-1. The squeezed heat dissipation path deteriorates its heat transfer efficiency to the underlying bulk Si layer, leading to severe self-heating effect. The self-heating effect is magnified by device scaling, which limits the applicability of SOI in electronics especially in the cases where high temperature and power dissipation are expected. In order to address this problem, Al2O3-Al2O3 bonding had been demonstrated and appeared to have favorable thermal characteristics [3]. In this paper, a more promising intermediate bonding layer is introduced. It shows the possibility of fabricating bonded wafer with enhanced thermal conductivity through room temperature AlN-AlN fusion bonding. Its strong heat dissipation capability is verified by COMSOL simulation and experimental results obtained from resistance thermal detector (RTD)." @default.
- W4250147404 created "2022-05-12" @default.
- W4250147404 date "2014-01-01" @default.
- W4250147404 modified "2023-10-17" @default.
- W4250147404 title "AlN-AlN Wafer Bonding and Its Thermal Characteristics" @default.
- W4250147404 doi "https://doi.org/10.1149/ma2014-02/34/1730" @default.
- W4250147404 hasPublicationYear "2014" @default.
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