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- W4250241955 abstract "Publisher SummaryThis chapter describes the general information on RCA Micromodules. The Micromodule has been developed not only for the newest of designs but also for those of the future. Keeping in mind, the need for workable components, minimum size, high reliability, and design uniformity, RCA engineers have established the 350 square as a standard module dimension. Microelements on standard, wafer-thin substrates, .310”×.310”, are stacked with an average spacing of approximately .010”. Twelve notches around the periphery of each element provide for interconnections among microelements forming a circuit. Over-all encapsulation makes each Micromodule a rugged, self-contained, environmentally protected unit. In addition, each microelement transistor and semiconductor diode is hermetically sealed. All components required for low-power circuitry can be mounted, and terminals provided on these tiny wafers. The modularized components are designated Microelements." @default.
- W4250241955 created "2022-05-12" @default.
- W4250241955 date "1964-01-01" @default.
- W4250241955 modified "2023-09-27" @default.
- W4250241955 title "GENERAL INFORMATION ON RCA MICROMODULES" @default.
- W4250241955 doi "https://doi.org/10.1016/b978-0-08-011064-6.50035-4" @default.
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