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- W4252164775 abstract "Wafer chucks and handlers were investigated for their release of particulate and metallic contamination onto the backside of the wafers. The wafers were analyzed for metallic impurities using TXRF and VPD-AAS measurement. Particulate contamination was investigated with a laser surface inspection system. Mapping of diffusion lengths of minority carriers was applied in order to make contamination patterns visible. Different chucks were investigated and evaluated. It was demonstrated that the contamination release depends strongly on surface coating and type of the chuck." @default.
- W4252164775 created "2022-05-12" @default.
- W4252164775 date "1983-01-01" @default.
- W4252164775 modified "2023-09-25" @default.
- W4252164775 title "Wafer flatness utilizing the pin-recess chuck" @default.
- W4252164775 doi "https://doi.org/10.1016/0026-2714(83)90435-3" @default.
- W4252164775 hasPublicationYear "1983" @default.
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