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- W4252781357 abstract "This paper reports on a flip-chip bonding technology using an aluminum bump at high temperatures, such as for SiC semiconductors. In recent years, double-sided mounting structures have been proposed for the purposes of miniaturization and low inductance. The surface mounting method requires durability to withstand high temperatures. We propose a new technique for the flip-chip bonding of an Al bump made from bonding wire. The recrystallization temperature of aluminum is under 250 °C. As a result, there is an expectation of mitigating mechanical stress between the chip and bonded substrate. A high-temperature exposure test at 250 °C for 3000 hours and a thermal-cycle test between −40 and 250 °C for 3000 cycles have been executed. Results indicate that shear strength of the Al bump meets the requirements set forth in the IEC60749-19 guideline until 2000 cycles at room temperature." @default.
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- W4252781357 date "2014-10-01" @default.
- W4252781357 modified "2023-09-30" @default.
- W4252781357 title "Reliability Assessment of Flip-chip Assembly of Al Bumps" @default.
- W4252781357 doi "https://doi.org/10.4071/isom-tp46" @default.
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