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- W4254454975 abstract "During r.f. sputtering of Cu layers on different metal Substrates, reactions at the Substrate- -layer interface lead to formation of the intermetallic compounds Cu4Cd3, CuGa, Cu9Ga4, Cu3Ge, Cu5Ge, Cuösns, Cu3Sn, CuZn4, and Cu5Zn3." @default.
- W4254454975 created "2022-05-12" @default.
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- W4254454975 date "1986-06-24" @default.
- W4254454975 modified "2023-10-18" @default.
- W4254454975 title "ChemInform Abstract: Reactions of r.f.-Sputtered Copper Layers with Cd, Ga, Ge, Sn, and Zn." @default.
- W4254454975 cites W1999984396 @default.
- W4254454975 doi "https://doi.org/10.1002/chin.198625038" @default.
- W4254454975 hasPublicationYear "1986" @default.
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