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- W4254561697 abstract "Liquid film migration was studied in a Cu-5 at % Sb alloy by both down-quenching and up-quenching from the initial liquation temperature in the two-phase, α + liquid, field. The time and temperature dependence of the migration distance and the rate of migration were studied in the temperature range of 440 to 760 °C. A near parabolic growth behaviour was observed. The coherency strain energy as calculated from the composition of the trailing grain was observed to be one order of magnitude higher than the interfacial energy of the cylindrical liquid film. The total chemical free energy was calculated to be one to three orders of magnitude higher than the coherency strain energy. A substantial part of the total chemical free energy is used for volume diffusion in front of the liquid film in the receding grain. The diffusion coefficients and the activation energy calculated at 730 to 760 °C correspond to those of the diffusion of Sb in liquid Cu. The activation energy is close to those of self diffusion in liquid Sb and Cu." @default.
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- W4254561697 date "2007-06-01" @default.
- W4254561697 modified "2023-10-14" @default.
- W4254561697 title "Liquid Film Migration in a Cu-5 At.% Sb Alloy" @default.
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- W4254561697 doi "https://doi.org/10.1179/000844307794535560" @default.
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