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- W4255912194 abstract "In 1979 at the American Chemical Society/Chemical Society of Japan Chemical Congress in Honolulu, the Division of Organic Coatings and Plastics Chemistry sponsored a symposium entitled Resins for Aerospace. This was an acknowledgment and tribute to the fact that the aerospace industry is a heavy contributor to the use and understanding of thermoset resin systems. The papers from this symposium later appeared as a 35-chapter book (1). Topics ranged from the design and testing of urethane launch tube seals to a search for readily removable coatings for electronic applications. In the aerospace industry, resinous polymers encompass a wide variety of hardware applications for aircraft, missiles, and space structures. In aircraft, resins are used as a matrix material for primary (flight-dependent) and secondary fiber-reinforced composite (FRC) structures, adhesives for the bonding of metal and composite hardware components, electronic circuit board materials, sealants, and radomes. Missile applications include equipment sections, motor cases," @default.
- W4255912194 created "2022-05-12" @default.
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- W4255912194 date "1985-09-25" @default.
- W4255912194 modified "2023-10-17" @default.
- W4255912194 title "Resins for Aerospace" @default.
- W4255912194 doi "https://doi.org/10.1021/bk-1985-0285.ch024" @default.
- W4255912194 hasPublicationYear "1985" @default.
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