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- W4256377047 abstract "Presented here is a method for wafer-level hermetic packaging at low temperature and with electrical feedthroughs, which is demonstrated on a microreactor. The packaging is done by Si-Si fusion bonding. This is achieved by protecting the silicon surface with thermal oxide and fabricating all the components in recesses. The protective oxide is removed by BHF, in order to preserve the initial very low roughness of silicon. The device has a channel accessible by an inlet and an outlet. A metal heater allows the temperature control inside the reaction chamber. The lateral feedthrough is achieved by sealing the chamber by a localized PECVD TEOS deposition through a shadow mask. The packaging method is compatible with low melting point metals." @default.
- W4256377047 created "2022-05-12" @default.
- W4256377047 date "1989-01-01" @default.
- W4256377047 modified "2023-09-30" @default.
- W4256377047 title "A time-of-flight quadrupole mass spectrometer system for measurements of thermal decomposition" @default.
- W4256377047 doi "https://doi.org/10.1016/0042-207x(89)90729-x" @default.
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