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- W4283374582 abstract "Researchers are rigorously trying to plan, innovate and discover, how machining can be made more economical and efficient. This paper presents a detailed investigation of fabricating micro-channels in c-Si wafer using fiber laser of 1064 nm wavelength. Scan speed, power and pulse frequency were considered as input parameters for experimentation. Taguchi L9 orthogonal array is adopted for design of experiment of input variables to study the micro channel depth. The investigation suggests that laser power has the highest impact on depth of the fabricated micro-channels in Si-wafer followed by scan speed and pulse frequency. Sensitivity analysis was also performed to check dominance of input factors on channel depth. At optimum conditions (scan speed-500 mm/s, power-50 W and frequency-25 Hz) the micro-channel depth was improved by 2.11 µm, previously it was 140.43 µm on trial 3. Microscopic analysis was performed to verify channel width deviation at optimal condition." @default.
- W4283374582 created "2022-06-25" @default.
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- W4283374582 date "2022-01-01" @default.
- W4283374582 modified "2023-09-30" @default.
- W4283374582 title "Investigation of fiber laser micro-channel depth on silicon wafer" @default.
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- W4283374582 doi "https://doi.org/10.1016/j.matpr.2022.02.024" @default.
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