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• W4285013826 endingPage "113219" @default.
• W4285013826 startingPage "113219" @default.
• W4285013826 abstract "Joining of tungsten (W) and copper (Cu) is of significance in fusion reactors. In this research, a novel method for enhancing direct alloying of W/Cu using nanoporous structures, but without using interlayer metals, is presented. The method mainly includes three steps: firstly, a pure-metal nanoporous layer was prepared on the surface of the W foil via anodizing and deoxidized annealing in H2 atmosphere; secondly, a layer of copper was electrodeposited on the nanoporous W and then annealed at the temperature close to TmCu (980°C); finally, the W/electroplated Cu layer/Cu joints were obtained by diffusion bonding in H2 atmosphere. The Owen-Wendt method was used to measure the surface energy of W. The test results showed that surface nano-activation of W can significantly promote the direct alloying and improve the tensile strength of W/Cu joints. The high-resolution transmission electron microscopy observation results showed that the diffusion distance between W and Cu reaches 32 nm (vs. 22 nm in our previous work). The maximum average tensile strength for W/Cu joints with nano-activation reached approximately 128 MPa, which is approximately 110% higher than that of W/Cu joints without nano-activation. Surface nano-activation can also enhance the thermal diffusivity of W/Cu joints at high temperatures. This nano-activation can promote direct alloying between W and Cu because it enables an increase in the amount of W crystal surfaces with high surface energy." @default.
• W4285013826 created "2022-07-12" @default.
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• W4285013826 date "2022-09-01" @default.
• W4285013826 modified "2023-10-18" @default.
• W4285013826 title "Improved strength and heat transfer of W/Cu joints via surface nano-activation of W" @default.
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• W4285013826 doi "https://doi.org/10.1016/j.fusengdes.2022.113219" @default.
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