FRINK Linked Data Fragments server

Matches in SemOpenAlex for { <https://semopenalex.org/work/W4285103029> ?p ?o ?g. }

• W4285103029 abstract "Hybrid copper bonding (HCB) technology has been introduced and evaluated to overcome a fine pitch limit and degradation in thermal properties in 3D semiconductor package structure. In this study, we successfully demonstrated 3D memory stacking package by HCB technology which integrated Cu-Cu diffusion bonding along with oxide bonding simultaneously. HCB process was developed and die-to-wafer (D2W) multi-stack structure was realized which shows excellent electrical and thermal properties. The flatness of the bonding surface was controlled by chemical mechanical polishing (CMP), and highly activated bonding surface desirable for HCB was obtained through optimization of plasma condition. The properties of the chip surface were measured in terms of oxide topography, Cu dishing height, surface hydrophilicity, hydroxyl group density, and adhesion force. Then package chips were stacked up to 12 levels by HCB method to demonstrate 12 stacked D2W package. In particular, we focused on eliminating oxide voids at the bonding interface since even a single void can deteriorate the functional properties of the whole stacked package. Oxide voids were classified into several categories on the basis of the causes, then the sources of the void were eliminated in advance to achieve void free HCB interfaces. Through the accomplishment of D2W HCB technology, it is expected to be applied to advanced 2.5D/3D packages for superior thermal and electrical performances." @default.
• W4285103029 created "2022-07-14" @default.
• W4285103029 creator A5001967366 @default.
• W4285103029 creator A5004639745 @default.
• W4285103029 creator A5026476580 @default.
• W4285103029 creator A5028398638 @default.
• W4285103029 creator A5034731588 @default.
• W4285103029 creator A5037834582 @default.
• W4285103029 creator A5038577249 @default.
• W4285103029 creator A5042385658 @default.
• W4285103029 creator A5045641909 @default.
• W4285103029 creator A5047618209 @default.
• W4285103029 creator A5058266666 @default.
• W4285103029 creator A5059282852 @default.
• W4285103029 creator A5069056881 @default.
• W4285103029 creator A5070585177 @default.
• W4285103029 creator A5091436206 @default.
• W4285103029 date "2022-05-01" @default.
• W4285103029 modified "2023-10-18" @default.
• W4285103029 title "A Study on Memory Stack Process by Hybrid Copper Bonding (HCB) Technology" @default.
• W4285103029 cites W2083260984 @default.
• W4285103029 cites W2529942914 @default.
• W4285103029 cites W2735069164 @default.
• W4285103029 cites W2885441259 @default.
• W4285103029 cites W2892358775 @default.
• W4285103029 cites W2904844661 @default.
• W4285103029 cites W2950067841 @default.
• W4285103029 cites W2951295197 @default.
• W4285103029 cites W2970163035 @default.
• W4285103029 cites W2970604310 @default.
• W4285103029 cites W2971335276 @default.
• W4285103029 cites W3015817134 @default.
• W4285103029 cites W3015861834 @default.
• W4285103029 cites W3048287875 @default.
• W4285103029 cites W3188966397 @default.
• W4285103029 doi "https://doi.org/10.1109/ectc51906.2022.00175" @default.
• W4285103029 hasPublicationYear "2022" @default.
• W4285103029 type Work @default.
• W4285103029 citedByCount "6" @default.
• W4285103029 countsByYear W42851030292022 @default.
• W4285103029 countsByYear W42851030292023 @default.
• W4285103029 crossrefType "proceedings-article" @default.
• W4285103029 hasAuthorship W4285103029A5001967366 @default.
• W4285103029 hasAuthorship W4285103029A5004639745 @default.
• W4285103029 hasAuthorship W4285103029A5026476580 @default.
• W4285103029 hasAuthorship W4285103029A5028398638 @default.
• W4285103029 hasAuthorship W4285103029A5034731588 @default.
• W4285103029 hasAuthorship W4285103029A5037834582 @default.
• W4285103029 hasAuthorship W4285103029A5038577249 @default.
• W4285103029 hasAuthorship W4285103029A5042385658 @default.
• W4285103029 hasAuthorship W4285103029A5045641909 @default.
• W4285103029 hasAuthorship W4285103029A5047618209 @default.
• W4285103029 hasAuthorship W4285103029A5058266666 @default.
• W4285103029 hasAuthorship W4285103029A5059282852 @default.
• W4285103029 hasAuthorship W4285103029A5069056881 @default.
• W4285103029 hasAuthorship W4285103029A5070585177 @default.
• W4285103029 hasAuthorship W4285103029A5091436206 @default.
• W4285103029 hasConcept C138113353 @default.
• W4285103029 hasConcept C140269135 @default.
• W4285103029 hasConcept C159985019 @default.
• W4285103029 hasConcept C160671074 @default.
• W4285103029 hasConcept C165005293 @default.
• W4285103029 hasConcept C178790620 @default.
• W4285103029 hasConcept C180088628 @default.
• W4285103029 hasConcept C185592680 @default.
• W4285103029 hasConcept C191897082 @default.
• W4285103029 hasConcept C192562407 @default.
• W4285103029 hasConcept C199360897 @default.
• W4285103029 hasConcept C201414436 @default.
• W4285103029 hasConcept C201845621 @default.
• W4285103029 hasConcept C2779133538 @default.
• W4285103029 hasConcept C2779227376 @default.
• W4285103029 hasConcept C2779772531 @default.
• W4285103029 hasConcept C2779851234 @default.
• W4285103029 hasConcept C33347731 @default.
• W4285103029 hasConcept C41008148 @default.
• W4285103029 hasConcept C49040817 @default.
• W4285103029 hasConcept C544778455 @default.
• W4285103029 hasConcept C76155785 @default.
• W4285103029 hasConcept C9395851 @default.
• W4285103029 hasConceptScore W4285103029C138113353 @default.
• W4285103029 hasConceptScore W4285103029C140269135 @default.
• W4285103029 hasConceptScore W4285103029C159985019 @default.
• W4285103029 hasConceptScore W4285103029C160671074 @default.
• W4285103029 hasConceptScore W4285103029C165005293 @default.
• W4285103029 hasConceptScore W4285103029C178790620 @default.
• W4285103029 hasConceptScore W4285103029C180088628 @default.
• W4285103029 hasConceptScore W4285103029C185592680 @default.
• W4285103029 hasConceptScore W4285103029C191897082 @default.
• W4285103029 hasConceptScore W4285103029C192562407 @default.
• W4285103029 hasConceptScore W4285103029C199360897 @default.
• W4285103029 hasConceptScore W4285103029C201414436 @default.
• W4285103029 hasConceptScore W4285103029C201845621 @default.
• W4285103029 hasConceptScore W4285103029C2779133538 @default.
• W4285103029 hasConceptScore W4285103029C2779227376 @default.
• W4285103029 hasConceptScore W4285103029C2779772531 @default.
• W4285103029 hasConceptScore W4285103029C2779851234 @default.
• W4285103029 hasConceptScore W4285103029C33347731 @default.
• W4285103029 hasConceptScore W4285103029C41008148 @default.
• W4285103029 hasConceptScore W4285103029C49040817 @default.

• next