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- W4285161556 endingPage "668" @default.
- W4285161556 startingPage "661" @default.
- W4285161556 abstract "To connect flip chips with copper pillars directly to a fine-pitch silicon interposer becomes a popular way in 2.5D integration and thermal compression bonding (TCB) is becoming an increasing important process step. The complexities combined with the need for faster TCB profiles present significant challenges for the development of TCB processes to yield good quality joints. In this paper, the flip chip bonding process on silicon interposer have been performed by selections of proper TCB parameters including bonding pressure, chip heating temperature and holding time which are optimized from wettability with bonding pads and solder bump height. Failure analysis of thermostatic heating is also applied to evaluate the intermetallic compound (IMC) in the solder joint reliability, which gives the hints of IMC ratio of the formed solder bump. Under the condition of long-term thermostatic heating, if the middle solder layer is much thinner than IMC layers generated on both sides in solder bump, it is easy to lead to cracking. Combining the above two aspects, it provides a method for development of flip chip bonding process on silicon interposer by using copper pillar." @default.
- W4285161556 created "2022-07-14" @default.
- W4285161556 creator A5038014359 @default.
- W4285161556 creator A5068365714 @default.
- W4285161556 creator A5079858305 @default.
- W4285161556 creator A5087908324 @default.
- W4285161556 date "2022-01-01" @default.
- W4285161556 modified "2023-10-14" @default.
- W4285161556 title "Development of Flip Chip Bonding Process on Silicon Interposer by Using Copper Pillar" @default.
- W4285161556 cites W2173259163 @default.
- W4285161556 cites W2507437953 @default.
- W4285161556 cites W2742519254 @default.
- W4285161556 cites W2742927268 @default.
- W4285161556 cites W2847077938 @default.
- W4285161556 cites W2987687171 @default.
- W4285161556 cites W2990458766 @default.
- W4285161556 cites W3115404642 @default.
- W4285161556 doi "https://doi.org/10.1007/978-981-19-1309-9_66" @default.
- W4285161556 hasPublicationYear "2022" @default.
- W4285161556 type Work @default.
- W4285161556 citedByCount "0" @default.
- W4285161556 crossrefType "book-chapter" @default.
- W4285161556 hasAuthorship W4285161556A5038014359 @default.
- W4285161556 hasAuthorship W4285161556A5068365714 @default.
- W4285161556 hasAuthorship W4285161556A5079858305 @default.
- W4285161556 hasAuthorship W4285161556A5087908324 @default.
- W4285161556 hasConcept C100460472 @default.
- W4285161556 hasConcept C111106434 @default.
- W4285161556 hasConcept C125619702 @default.
- W4285161556 hasConcept C158802814 @default.
- W4285161556 hasConcept C159985019 @default.
- W4285161556 hasConcept C171250308 @default.
- W4285161556 hasConcept C191897082 @default.
- W4285161556 hasConcept C192562407 @default.
- W4285161556 hasConcept C201845621 @default.
- W4285161556 hasConcept C27501479 @default.
- W4285161556 hasConcept C2779227376 @default.
- W4285161556 hasConcept C2780026712 @default.
- W4285161556 hasConcept C45632049 @default.
- W4285161556 hasConcept C49040817 @default.
- W4285161556 hasConcept C50296614 @default.
- W4285161556 hasConcept C530198007 @default.
- W4285161556 hasConcept C544956773 @default.
- W4285161556 hasConcept C59088047 @default.
- W4285161556 hasConcept C68928338 @default.
- W4285161556 hasConcept C79072407 @default.
- W4285161556 hasConceptScore W4285161556C100460472 @default.
- W4285161556 hasConceptScore W4285161556C111106434 @default.
- W4285161556 hasConceptScore W4285161556C125619702 @default.
- W4285161556 hasConceptScore W4285161556C158802814 @default.
- W4285161556 hasConceptScore W4285161556C159985019 @default.
- W4285161556 hasConceptScore W4285161556C171250308 @default.
- W4285161556 hasConceptScore W4285161556C191897082 @default.
- W4285161556 hasConceptScore W4285161556C192562407 @default.
- W4285161556 hasConceptScore W4285161556C201845621 @default.
- W4285161556 hasConceptScore W4285161556C27501479 @default.
- W4285161556 hasConceptScore W4285161556C2779227376 @default.
- W4285161556 hasConceptScore W4285161556C2780026712 @default.
- W4285161556 hasConceptScore W4285161556C45632049 @default.
- W4285161556 hasConceptScore W4285161556C49040817 @default.
- W4285161556 hasConceptScore W4285161556C50296614 @default.
- W4285161556 hasConceptScore W4285161556C530198007 @default.
- W4285161556 hasConceptScore W4285161556C544956773 @default.
- W4285161556 hasConceptScore W4285161556C59088047 @default.
- W4285161556 hasConceptScore W4285161556C68928338 @default.
- W4285161556 hasConceptScore W4285161556C79072407 @default.
- W4285161556 hasLocation W42851615561 @default.
- W4285161556 hasOpenAccess W4285161556 @default.
- W4285161556 hasPrimaryLocation W42851615561 @default.
- W4285161556 hasRelatedWork W1600708258 @default.
- W4285161556 hasRelatedWork W1608524455 @default.
- W4285161556 hasRelatedWork W1986637956 @default.
- W4285161556 hasRelatedWork W2006267100 @default.
- W4285161556 hasRelatedWork W2015719117 @default.
- W4285161556 hasRelatedWork W2021952043 @default.
- W4285161556 hasRelatedWork W2038124782 @default.
- W4285161556 hasRelatedWork W2068436155 @default.
- W4285161556 hasRelatedWork W2119289729 @default.
- W4285161556 hasRelatedWork W2786165659 @default.
- W4285161556 isParatext "false" @default.
- W4285161556 isRetracted "false" @default.
- W4285161556 workType "book-chapter" @default.