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- W4285229938 endingPage "1260" @default.
- W4285229938 startingPage "1250" @default.
- W4285229938 abstract "In the field of thermal design of electronic equipment, the use of thermal interface materials is the main means to reduce the thermal resistance of interface contact and the temperature rise of controller. Aiming at the disadvantages of high cost and long test time of contact thermal resistance test platform under high vacuum, a temperature compensation scheme is proposed, which makes the test error of contact thermal resistance under normal temperature and pressure within 5% and the test time within 2 h, and improves the test efficiency and accuracy. The effects of three thermal interface materials, thermal conductive silicone grease, thermal conductive rubber pad and indium sheet, on the solid-solid interface contact thermal resistance with the change of loading pressure were studied by steady-state heat flow method. The experimental results show that the pressure of 30 Psi is the recommended pressure for engineering. When the pressure is less than 30 Psi, the influence of thermal conductive silicone grease and thermal conductive rubber pad on the contact thermal resistance changes significantly with the pressure; When the pressure is greater than 30 Psi, the effect of thermal conductive silicone grease and thermal conductive rubber pad on the contact thermal resistance is not obvious with the change of pressure; The thickness of thermal conductive rubber pad has a great influence on the contact thermal resistance with the change of pressure, and the influence of indium sheet on the contact thermal resistance with the change of pressure is approximately linear." @default.
- W4285229938 created "2022-07-14" @default.
- W4285229938 creator A5050437695 @default.
- W4285229938 date "2022-01-01" @default.
- W4285229938 modified "2023-09-30" @default.
- W4285229938 title "Experimental Study on Contact Thermal Resistance of Common Thermal Interface Materials" @default.
- W4285229938 cites W1977742178 @default.
- W4285229938 cites W1978353390 @default.
- W4285229938 cites W1988846675 @default.
- W4285229938 cites W2004627082 @default.
- W4285229938 cites W2049638322 @default.
- W4285229938 cites W2086801732 @default.
- W4285229938 cites W2144325198 @default.
- W4285229938 cites W2192724399 @default.
- W4285229938 cites W2611557858 @default.
- W4285229938 cites W2765248084 @default.
- W4285229938 cites W2884979960 @default.
- W4285229938 cites W3015978428 @default.
- W4285229938 doi "https://doi.org/10.1007/978-981-19-1309-9_121" @default.
- W4285229938 hasPublicationYear "2022" @default.
- W4285229938 type Work @default.
- W4285229938 citedByCount "0" @default.
- W4285229938 crossrefType "book-chapter" @default.
- W4285229938 hasAuthorship W4285229938A5050437695 @default.
- W4285229938 hasConcept C121332964 @default.
- W4285229938 hasConcept C123671423 @default.
- W4285229938 hasConcept C137693562 @default.
- W4285229938 hasConcept C159985019 @default.
- W4285229938 hasConcept C176933379 @default.
- W4285229938 hasConcept C192562407 @default.
- W4285229938 hasConcept C200657195 @default.
- W4285229938 hasConcept C202374169 @default.
- W4285229938 hasConcept C204530211 @default.
- W4285229938 hasConcept C2776290925 @default.
- W4285229938 hasConcept C2779227376 @default.
- W4285229938 hasConcept C45058047 @default.
- W4285229938 hasConcept C97346530 @default.
- W4285229938 hasConcept C97355855 @default.
- W4285229938 hasConceptScore W4285229938C121332964 @default.
- W4285229938 hasConceptScore W4285229938C123671423 @default.
- W4285229938 hasConceptScore W4285229938C137693562 @default.
- W4285229938 hasConceptScore W4285229938C159985019 @default.
- W4285229938 hasConceptScore W4285229938C176933379 @default.
- W4285229938 hasConceptScore W4285229938C192562407 @default.
- W4285229938 hasConceptScore W4285229938C200657195 @default.
- W4285229938 hasConceptScore W4285229938C202374169 @default.
- W4285229938 hasConceptScore W4285229938C204530211 @default.
- W4285229938 hasConceptScore W4285229938C2776290925 @default.
- W4285229938 hasConceptScore W4285229938C2779227376 @default.
- W4285229938 hasConceptScore W4285229938C45058047 @default.
- W4285229938 hasConceptScore W4285229938C97346530 @default.
- W4285229938 hasConceptScore W4285229938C97355855 @default.
- W4285229938 hasLocation W42852299381 @default.
- W4285229938 hasOpenAccess W4285229938 @default.
- W4285229938 hasPrimaryLocation W42852299381 @default.
- W4285229938 hasRelatedWork W1499153530 @default.
- W4285229938 hasRelatedWork W181830624 @default.
- W4285229938 hasRelatedWork W2015492317 @default.
- W4285229938 hasRelatedWork W2146764056 @default.
- W4285229938 hasRelatedWork W2403835168 @default.
- W4285229938 hasRelatedWork W2604231558 @default.
- W4285229938 hasRelatedWork W2626897216 @default.
- W4285229938 hasRelatedWork W2670894496 @default.
- W4285229938 hasRelatedWork W3213766846 @default.
- W4285229938 hasRelatedWork W4221054307 @default.
- W4285229938 isParatext "false" @default.
- W4285229938 isRetracted "false" @default.
- W4285229938 workType "book-chapter" @default.