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- W4285389640 abstract "Diamond/aluminum composite material has the advantages of high thermal conductivity, low expansion, and lightweight, which has a wide range of application prospects in the field of electronic packaging thermal management. However, the serious interface problems between diamond and aluminum limit the full play of the thermal conductivity of composite materials. A reasonable interface design can maximize the thermal conductivity of composite materials. This article focuses on the interface modification of diamond/aluminum composites, briefly describing the theoretical basis of interface design, the research status of interface modification, interface reaction and composite stability, and prospects for diamond/aluminum composites material development." @default.
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- W4285389640 date "2022-07-14" @default.
- W4285389640 modified "2023-10-18" @default.
- W4285389640 title "Research progress of diamond/aluminum composite interface design" @default.
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- W4285389640 doi "https://doi.org/10.1080/26941112.2022.2050953" @default.
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