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- W4285486542 abstract "Thermal stresses [1-4] in solder joint interconnections (see, e.g., [5]) used in electronic and photonic packaging are proportional to the thermal contraction mismatch strains T [3-9]. Here is the effective coefficient of thermal expansion (CTE) mismatch between the soldered materials (the chip or the package to their substrates), and T is the change in temperature from the elevated manufacturing (bonding/fabrication/solder ing) temperature, at which, because of the interaction of shrinkage and stressrelaxation processes, the induced stresses are next-to-zero, to the low, room, testing or operation, temperature, at which the induced stresses are the highest. Clearly, these stresses are lower for lower soldering temperatures, and therefore there is an obvious incentive for using low temperature solders. What is less obvious is that significant stress relief in solder joints can be achieved also by employing, for the same materials and the same thermal mismatch strain T, inhomogeneous bonds [10-19], when, e.g., a solder material with a high soldering temperature and/or with a high Young’s/shear modulus is employed in the mid-portion of the assembly, where the stresses in this material are low (at the mid-cross-section of the assembly these stresses, distributed in an anti-symmetric fashion, are always zero), and a low-melting-point solder and/or a solder with a lower modulus is employed at the assembly’s peripheral portions, where the interfacial shearing and peeling thermal stresses are the highest. Ultimately, when only the elevated stresses, and not heat transfer considerations, are viewed to be critical, even assemblies bonded at the ends only are viable [16,17]." @default.
- W4285486542 created "2022-07-15" @default.
- W4285486542 date "2021-02-17" @default.
- W4285486542 modified "2023-10-16" @default.
- W4285486542 title "Inhomogeneous Bonding in Low-TemperatureSoldering: Brief Review" @default.
- W4285486542 cites W1469735908 @default.
- W4285486542 cites W1804599644 @default.
- W4285486542 cites W1966996830 @default.
- W4285486542 cites W1968924121 @default.
- W4285486542 cites W2042191317 @default.
- W4285486542 cites W2048613540 @default.
- W4285486542 cites W2064690817 @default.
- W4285486542 cites W2114068746 @default.
- W4285486542 cites W2140821909 @default.
- W4285486542 cites W2201425444 @default.
- W4285486542 cites W2265216270 @default.
- W4285486542 cites W2276331853 @default.
- W4285486542 cites W2285930949 @default.
- W4285486542 cites W2302542716 @default.
- W4285486542 cites W2338714406 @default.
- W4285486542 cites W2341706620 @default.
- W4285486542 cites W2504839367 @default.
- W4285486542 cites W2567885456 @default.
- W4285486542 cites W2769639526 @default.
- W4285486542 cites W2904023008 @default.
- W4285486542 cites W2916680699 @default.
- W4285486542 cites W2920941010 @default.
- W4285486542 cites W2994917877 @default.
- W4285486542 cites W4240718264 @default.
- W4285486542 doi "https://doi.org/10.31829/2689-6958/jes2021-4(1)-001" @default.
- W4285486542 hasPublicationYear "2021" @default.
- W4285486542 type Work @default.
- W4285486542 citedByCount "0" @default.
- W4285486542 crossrefType "journal-article" @default.
- W4285486542 hasBestOaLocation W42854865421 @default.
- W4285486542 hasConcept C13530604 @default.
- W4285486542 hasConcept C152279782 @default.
- W4285486542 hasConcept C159985019 @default.
- W4285486542 hasConcept C180145272 @default.
- W4285486542 hasConcept C192562407 @default.
- W4285486542 hasConcept C193867417 @default.
- W4285486542 hasConcept C21141959 @default.
- W4285486542 hasConcept C47463417 @default.
- W4285486542 hasConcept C50296614 @default.
- W4285486542 hasConcept C69567186 @default.
- W4285486542 hasConceptScore W4285486542C13530604 @default.
- W4285486542 hasConceptScore W4285486542C152279782 @default.
- W4285486542 hasConceptScore W4285486542C159985019 @default.
- W4285486542 hasConceptScore W4285486542C180145272 @default.
- W4285486542 hasConceptScore W4285486542C192562407 @default.
- W4285486542 hasConceptScore W4285486542C193867417 @default.
- W4285486542 hasConceptScore W4285486542C21141959 @default.
- W4285486542 hasConceptScore W4285486542C47463417 @default.
- W4285486542 hasConceptScore W4285486542C50296614 @default.
- W4285486542 hasConceptScore W4285486542C69567186 @default.
- W4285486542 hasLocation W42854865421 @default.
- W4285486542 hasOpenAccess W4285486542 @default.
- W4285486542 hasPrimaryLocation W42854865421 @default.
- W4285486542 hasRelatedWork W2050480266 @default.
- W4285486542 hasRelatedWork W2053291093 @default.
- W4285486542 hasRelatedWork W2073489278 @default.
- W4285486542 hasRelatedWork W2077789538 @default.
- W4285486542 hasRelatedWork W2078620962 @default.
- W4285486542 hasRelatedWork W2113366365 @default.
- W4285486542 hasRelatedWork W2289236174 @default.
- W4285486542 hasRelatedWork W2368692178 @default.
- W4285486542 hasRelatedWork W3043268847 @default.
- W4285486542 hasRelatedWork W4223522124 @default.
- W4285486542 isParatext "false" @default.
- W4285486542 isRetracted "false" @default.
- W4285486542 workType "article" @default.