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• W4285807780 endingPage "129718" @default.
• W4285807780 startingPage "129718" @default.
• W4285807780 abstract "Colloidal silica occupies the field of polishing solution application of chemical mechanical polishing (CMP). Si-OH groups dominate the surface of colloidal silica nanoparticles, and their chemical nature, acidity, is a determining factor for CMP. However, due to the delicate nature, very vulnerable to self-condensation at elevated temperatures, of colloidal silica nanoparticles, traditional techniques used for characterizing powder samples are limited to gaining true insights into the chemical reactivity of these Si-OH groups without disturbing the surface chemistry, which hinders the deep exploration of the essential mechanism of CMP on silica. In this manuscript, low-field nuclear magnetic resonance (LF NMR) and freeze-drying-programmed temperature desorption (TPD) techniques were, for the first time, combined to investigate the true acidity of the surface Si-OH groups in colloidal silica with minimized perturbance from sample preparations. The results from both characterization methodologies complemented each other, and are in good agreement about the surface structure and acidity of the surface Si-OH groups on colloidal silica. The results demonstrate that the acidity of Si-OH hydroxyl groups on the surface of silica-soluble nanoparticles spreads in a very broad range from very weak, medium-strong, to very strong. CMP performance of sapphire substrates by using colloidal silica strongly correlates with the acidic nature of surface Si-OH groups at the acidic polishing condition. The stronger acidity of surface Si-OH groups, the higher material removal rates in sapphire polishing through the chemical bonding of deprotonated Si-O- functional surface of colloidal silica with hydrolyzed sapphire Al-OH surface. Therefore, when a large number of Si-O- active centers in the basic environment attack the sapphire Al-OH sites, the rate of the chemical reaction is accelerated." @default.
• W4285807780 created "2022-07-19" @default.
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• W4285807780 date "2022-10-01" @default.
• W4285807780 modified "2023-10-16" @default.
• W4285807780 title "Surface acidity of colloidal silica and its correlation with sapphire surface polishing" @default.
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• W4285807780 doi "https://doi.org/10.1016/j.colsurfa.2022.129718" @default.
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