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• W4286512135 endingPage "108421" @default.
• W4286512135 startingPage "108421" @default.
• W4286512135 abstract "• Low-temperature deuterium (D 2 ) annealing (LTDA) to improve performances and reliability of a MOSFET. • Reducing a thermal budget especially in the backend-of-the-line (BEOL). • Quantitative analysis for improvement of electrical performance. • Profiling of D 2 by secondary ion mass spectrometry (SIMS). Low-temperature deuterium (D 2 ) annealing (LTDA) is applied to improve performances and reliability of a MOSFET. The LTDA is performed at 300 °C, which is at least 100 °C lower than the widely used temperature of forming gas annealing (FGA) with H 2 , which contributes to reducing a thermal budget especially in the backend-of-the-line (BEOL). DC performances, such as subthreshold slope ( SS ), threshold voltage ( V TH ), and on-current ( I ON ) were statistically compared in cases with and without the LTDA to evaluate their improvements. Profiling of D 2 by secondary ion mass spectrometry (SIMS) supports that D 2 can permeate a gate oxide and passivate dangling bonds and traps near the interface of the SiO 2 -Si channel. Therefore I ON , SS , and V TH were improved, gate leakage current ( I G ) was reduced, and immunity to positive bias stress (PBS) became better." @default.
• W4286512135 created "2022-07-22" @default.
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• W4286512135 date "2022-11-01" @default.
• W4286512135 modified "2023-10-14" @default.
• W4286512135 title "Low-temperature deuterium annealing to improve performance and reliability in a MOSFET" @default.
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• W4286512135 doi "https://doi.org/10.1016/j.sse.2022.108421" @default.
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