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- W4288040769 abstract "The basic element of the design of a power module is a metallized ceramic substrate. In this work, the formation of metallization coatings by the method of thermal transfer of metallization pastes (Mo-Mn-Si + binder) for alumina and aluminum nitride ceramics was carried out. The fixing of the metallization coating on the ceramic substrate was performed by firing at a temperature of 1320 °C. The subsequent deposition of the copper layer was carried out by the method of cold gas-dynamic spraying (CGDS) followed by annealing of the deposited coating. For high-quality adhesion, the optimum annealing temperature was 1000 °C." @default.
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- W4288040769 date "2022-07-26" @default.
- W4288040769 modified "2023-09-26" @default.
- W4288040769 title "Development of technology for deposition of thick copper layers onto ceramic substrates applied in power electronics" @default.
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- W4288040769 doi "https://doi.org/10.15826/chimtech.2022.9.3.07" @default.
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