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- W4290804423 abstract "In the near future, the conventional way of applying solder resist in purely subtractive processes for printed circuit boards will be replaced by the technology of a digital, functional 3D surface applied in fully additive technology. This chapter shows the approach for the gradual digitalization of printed circuit board production and its processes. An example of this is the new process of digital additive technology for solder resists, which makes it possible to implement customer wishes and special technological requirements. Up so far, this process is the first and only technology in the industry to offer the possibility of applying several layers of a dielectric directly, partially defined, specifically designed, and with high precision. This enables a previously unseen degree of freedom in three-dimensional design. On the whole, this chapter shows a revolutionary technology with the potential for a new, digital, and three-dimensional technology level for printed circuit boards." @default.
- W4290804423 created "2022-08-12" @default.
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- W4290804423 date "2022-08-11" @default.
- W4290804423 modified "2023-10-16" @default.
- W4290804423 title "Inkjet in the <scp>PCB</scp> ‐Production" @default.
- W4290804423 doi "https://doi.org/10.1002/9783527828074.ch54" @default.
- W4290804423 hasPublicationYear "2022" @default.
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