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- W4294224072 abstract "A hybrid random walk method is presented for the thermal analysis of integrated circuits. Preserving the advantage of generic random walk method (GRW), i.e. the suitability for simulating local hot-spots, the proposed techniques largely reduce its runtime for accurate high-resolution simulation, and is suitable for the realistic pyramid-shape IC model. This is achieved by combining the GRW and the floating random walk techniques, and a novel usage of rectangular cuboid transition domain. The techniques to handle Neumann boundary and convective boundary in thermal simulation are also discussed. Numerical experiments on several integrated circuit (IC) test cases validate the efficiency and accuracy of the proposed techniques, and demonstrate several tens times speedup over the GRW method while keeping high accuracy." @default.
- W4294224072 created "2022-09-02" @default.
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- W4294224072 date "2022-09-03" @default.
- W4294224072 modified "2023-10-18" @default.
- W4294224072 title "A Hybrid Random Walk Algorithm for 3-D Thermal Analysis" @default.
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- W4294224072 doi "https://doi.org/10.1007/978-981-19-3250-2_12" @default.
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