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- W4294927554 abstract "In this work, an inexpensive and self-reducible Cu-Ni composite ink was designed for low temperature fabrication of the highly conductive and anti-oxidative Cu-Ni electrodes. The Cu-Ni electrode was obtained at a lower sintering temperature originating from the self-catalyzed characteristic of Cu micron particles. Consequently, the Cu-Ni electrode sintered at 180 °C exhibits high conductivity with a low electrical resistivity of 7.1 × 10−5 Ω.cm. and its relative resistance is significantly lower than that of Cu electrode after the high temperature aging test. These results indicate that the self-reducible Cu-Ni composite ink provides a promising prospect for the highly conductive and stable electrode." @default.
- W4294927554 created "2022-09-08" @default.
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- W4294927554 date "2022-12-01" @default.
- W4294927554 modified "2023-10-16" @default.
- W4294927554 title "Cost-effective and self-reducible Cu-Ni composite ink for low temperature fabrication of highly conductive and anti-oxidative electrodes" @default.
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- W4294927554 doi "https://doi.org/10.1016/j.matlet.2022.133134" @default.
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