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- W4295531899 abstract "Most of the consumables used in the CMP (Chemical Mechanical Planarization) process are discarded because it is difficult to reuse them. Slurry accounts for most of the consumables, so research is being conducted to reduce the amount of slurry used. A previous study explains that when the same amount of slurry is injected, the material removal rate is improved when the slurry is injected wide and thin instead of the tube nozzle, which is the conventional slurry injection method. However, there was no change in the injection method due to the problems of the injection method suggested in previous studies and the lack of follow-up studies. Thus, in this paper, an injection method through an ultrasonic spray nozzle is proposed to improve the problems of the injection method proposed in previous studies. Additionally, it is intended to calculate the slurry film thickness according to the spraying range and to explain the effect of the film thickness on the material removal rate." @default.
- W4295531899 created "2022-09-14" @default.
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- W4295531899 date "2022-09-01" @default.
- W4295531899 modified "2023-09-29" @default.
- W4295531899 title "Effect of Slurry Film Thickness Variation according to Spray Range Using Ultrasonic Spray Nozzle on Material Removal Rate" @default.
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- W4295531899 doi "https://doi.org/10.7736/jkspe.022.036" @default.
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