Matches in SemOpenAlex for { <https://semopenalex.org/work/W429555737> ?p ?o ?g. }
Showing items 1 to 59 of
59
with 100 items per page.
- W429555737 endingPage "562" @default.
- W429555737 startingPage "556" @default.
- W429555737 abstract "If surface mounted IC packages contain absorbed moisture, the vapor pressure generated inside the package when they are heated during the reflow soldering process may cause cracking. Our earlier report described how this vapor pressure could be determined by 1-dimensional analysis of the moisture diffusion in the plastic below the chip pad. Because package cracking due to moisture absorbed in the chip bonding paste has recently elicited of wide interest, we performed a 2-dimensional analysis of moisture diffusion in the plastic and in the paste. Using the method proposed in a previous report, we evaluated the strength of the plastic according to three types of models of the cracking mechanism. The present analysis investigates how package cracking is influenced by moisture absorbed into the paste." @default.
- W429555737 created "2016-06-24" @default.
- W429555737 creator A5050775101 @default.
- W429555737 creator A5050961225 @default.
- W429555737 creator A5064871346 @default.
- W429555737 date "1994-01-01" @default.
- W429555737 modified "2023-09-25" @default.
- W429555737 title "A Study of Package Cracking during the Reflow Soldering Process. 3rd Report, Influence of Chip Bonding Paste." @default.
- W429555737 doi "https://doi.org/10.1299/kikaia.60.556" @default.
- W429555737 hasPublicationYear "1994" @default.
- W429555737 type Work @default.
- W429555737 sameAs 429555737 @default.
- W429555737 citedByCount "0" @default.
- W429555737 crossrefType "journal-article" @default.
- W429555737 hasAuthorship W429555737A5050775101 @default.
- W429555737 hasAuthorship W429555737A5050961225 @default.
- W429555737 hasAuthorship W429555737A5064871346 @default.
- W429555737 hasBestOaLocation W4295557371 @default.
- W429555737 hasConcept C159985019 @default.
- W429555737 hasConcept C165005293 @default.
- W429555737 hasConcept C176864760 @default.
- W429555737 hasConcept C191897082 @default.
- W429555737 hasConcept C192562407 @default.
- W429555737 hasConcept C2778413121 @default.
- W429555737 hasConcept C41008148 @default.
- W429555737 hasConcept C50296614 @default.
- W429555737 hasConcept C58396970 @default.
- W429555737 hasConcept C76155785 @default.
- W429555737 hasConceptScore W429555737C159985019 @default.
- W429555737 hasConceptScore W429555737C165005293 @default.
- W429555737 hasConceptScore W429555737C176864760 @default.
- W429555737 hasConceptScore W429555737C191897082 @default.
- W429555737 hasConceptScore W429555737C192562407 @default.
- W429555737 hasConceptScore W429555737C2778413121 @default.
- W429555737 hasConceptScore W429555737C41008148 @default.
- W429555737 hasConceptScore W429555737C50296614 @default.
- W429555737 hasConceptScore W429555737C58396970 @default.
- W429555737 hasConceptScore W429555737C76155785 @default.
- W429555737 hasIssue "570" @default.
- W429555737 hasLocation W4295557371 @default.
- W429555737 hasOpenAccess W429555737 @default.
- W429555737 hasPrimaryLocation W4295557371 @default.
- W429555737 hasRelatedWork W1591419896 @default.
- W429555737 hasRelatedWork W2006221599 @default.
- W429555737 hasRelatedWork W2080679998 @default.
- W429555737 hasRelatedWork W2097447710 @default.
- W429555737 hasRelatedWork W2104986166 @default.
- W429555737 hasRelatedWork W2170704383 @default.
- W429555737 hasRelatedWork W2313869868 @default.
- W429555737 hasRelatedWork W2349310191 @default.
- W429555737 hasRelatedWork W429555737 @default.
- W429555737 hasRelatedWork W2131381280 @default.
- W429555737 hasVolume "60" @default.
- W429555737 isParatext "false" @default.
- W429555737 isRetracted "false" @default.
- W429555737 magId "429555737" @default.
- W429555737 workType "article" @default.