Matches in SemOpenAlex for { <https://semopenalex.org/work/W4296203744> ?p ?o ?g. }
- W4296203744 endingPage "318" @default.
- W4296203744 startingPage "308" @default.
- W4296203744 abstract "This paper presents the effect of electromigration and isothermal ageing in lead-free SAC305 (Sn3Ag0.5Cu) solder joints of chip-size surface mounted (SMD) components, where different track-to-pad joining angles define the current density in the joint. The samples were based on 0402 and 0603 size components and were loaded for an extensive period of 4000 h with 2 and 2.5 A, respectively, in an increased temperature environment (40 °C). The solder joint reliability was assessed at selected times during the loading, with shear tests and cross-section analysis on metallurgic structures. Optical and scanning electron microscopy were used to analyse the microstructure of the solder joints. The shear strength of the solder joints was found to decrease with the increasing loading times. Intermetallic compound (IMC) was found on the 4000 h current stressed samples fracture surface, contrary to the other samples. The IMC layer thickness increased with the loading times and was slightly higher for the anode side of the current stressed components. The current stressing resulted in extensive copper dissolution from the pad and IMC layer accumulation at the component metallisation at the cathode side, affecting the reliability of the joints and pointing to electromigration." @default.
- W4296203744 created "2022-09-18" @default.
- W4296203744 creator A5003502797 @default.
- W4296203744 creator A5010915863 @default.
- W4296203744 creator A5033913018 @default.
- W4296203744 date "2022-11-01" @default.
- W4296203744 modified "2023-09-30" @default.
- W4296203744 title "Impact of electromigration and isothermal ageing on lead-free solder joints of chip-sized SMD components" @default.
- W4296203744 cites W1247971784 @default.
- W4296203744 cites W1545464916 @default.
- W4296203744 cites W1963607899 @default.
- W4296203744 cites W1967892516 @default.
- W4296203744 cites W1986854664 @default.
- W4296203744 cites W2017259805 @default.
- W4296203744 cites W2018938304 @default.
- W4296203744 cites W2034018236 @default.
- W4296203744 cites W2038303506 @default.
- W4296203744 cites W2044103838 @default.
- W4296203744 cites W2047906250 @default.
- W4296203744 cites W2053709945 @default.
- W4296203744 cites W2058885604 @default.
- W4296203744 cites W2060772729 @default.
- W4296203744 cites W2067477914 @default.
- W4296203744 cites W2076329651 @default.
- W4296203744 cites W2083428498 @default.
- W4296203744 cites W2090294858 @default.
- W4296203744 cites W2098366883 @default.
- W4296203744 cites W2110641793 @default.
- W4296203744 cites W2128890552 @default.
- W4296203744 cites W2145015029 @default.
- W4296203744 cites W2151263375 @default.
- W4296203744 cites W2297639486 @default.
- W4296203744 cites W2527503383 @default.
- W4296203744 cites W2550486759 @default.
- W4296203744 cites W2564307206 @default.
- W4296203744 cites W2606434102 @default.
- W4296203744 cites W2774113820 @default.
- W4296203744 cites W2786251903 @default.
- W4296203744 cites W2920806321 @default.
- W4296203744 cites W2967468127 @default.
- W4296203744 cites W3093005482 @default.
- W4296203744 cites W3119893579 @default.
- W4296203744 cites W3135079986 @default.
- W4296203744 cites W4206152041 @default.
- W4296203744 cites W4210869892 @default.
- W4296203744 cites W617277342 @default.
- W4296203744 cites W91144062 @default.
- W4296203744 doi "https://doi.org/10.1016/j.jmrt.2022.09.048" @default.
- W4296203744 hasPublicationYear "2022" @default.
- W4296203744 type Work @default.
- W4296203744 citedByCount "6" @default.
- W4296203744 countsByYear W42962037442023 @default.
- W4296203744 crossrefType "journal-article" @default.
- W4296203744 hasAuthorship W4296203744A5003502797 @default.
- W4296203744 hasAuthorship W4296203744A5010915863 @default.
- W4296203744 hasAuthorship W4296203744A5033913018 @default.
- W4296203744 hasBestOaLocation W42962037441 @default.
- W4296203744 hasConcept C121332964 @default.
- W4296203744 hasConcept C127413603 @default.
- W4296203744 hasConcept C127893833 @default.
- W4296203744 hasConcept C133347239 @default.
- W4296203744 hasConcept C138055206 @default.
- W4296203744 hasConcept C147789679 @default.
- W4296203744 hasConcept C159390177 @default.
- W4296203744 hasConcept C159750122 @default.
- W4296203744 hasConcept C159985019 @default.
- W4296203744 hasConcept C17525397 @default.
- W4296203744 hasConcept C18555067 @default.
- W4296203744 hasConcept C185592680 @default.
- W4296203744 hasConcept C191897082 @default.
- W4296203744 hasConcept C192562407 @default.
- W4296203744 hasConcept C207740977 @default.
- W4296203744 hasConcept C26771246 @default.
- W4296203744 hasConcept C27501479 @default.
- W4296203744 hasConcept C2779227376 @default.
- W4296203744 hasConcept C2780026712 @default.
- W4296203744 hasConcept C39432304 @default.
- W4296203744 hasConcept C50296614 @default.
- W4296203744 hasConcept C62520636 @default.
- W4296203744 hasConcept C66938386 @default.
- W4296203744 hasConcept C68928338 @default.
- W4296203744 hasConcept C79072407 @default.
- W4296203744 hasConcept C87976508 @default.
- W4296203744 hasConcept C89395315 @default.
- W4296203744 hasConcept C97355855 @default.
- W4296203744 hasConceptScore W4296203744C121332964 @default.
- W4296203744 hasConceptScore W4296203744C127413603 @default.
- W4296203744 hasConceptScore W4296203744C127893833 @default.
- W4296203744 hasConceptScore W4296203744C133347239 @default.
- W4296203744 hasConceptScore W4296203744C138055206 @default.
- W4296203744 hasConceptScore W4296203744C147789679 @default.
- W4296203744 hasConceptScore W4296203744C159390177 @default.
- W4296203744 hasConceptScore W4296203744C159750122 @default.
- W4296203744 hasConceptScore W4296203744C159985019 @default.
- W4296203744 hasConceptScore W4296203744C17525397 @default.
- W4296203744 hasConceptScore W4296203744C18555067 @default.
- W4296203744 hasConceptScore W4296203744C185592680 @default.
- W4296203744 hasConceptScore W4296203744C191897082 @default.