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- W4296252664 abstract "The paper presents the results of the analysis of the porous structure of polishing materials based on polyurethanes used in the process of chemical-mechanical planarization of layers of integrated circuits. The technology of obtaining porous samples by solid-state microcellular foaming is described" @default.
- W4296252664 created "2022-09-19" @default.
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- W4296252664 date "2021-10-01" @default.
- W4296252664 modified "2023-09-27" @default.
- W4296252664 title "Development of polyurethane polymer materials for chemical- mechanical polishing of dielectric layers of integrated circuits" @default.
- W4296252664 doi "https://doi.org/10.37816/eeste-2021-2-189-192" @default.
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