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- W4296641860 abstract "The quenching expansion tests in the temperature range 350~500 ℃ and isothermal compression tests in the range 350~500 ℃ & 0.01~10 s -1 of a homogenized Al-Cu-Li alloy were conducted to investigate the flow behavior and thermal expansion behavior. The corresponding microstructures of the tested specimens were characterized by back-scattered electron-scanning electron microscope (BSE-SEM), electron back-scattered diffraction (EBSD) and transmission electron microscope (TEM). Coarse secondary phases including Al 2 CuLi (T 1 ), Al 2 (Cu-Ag)(Li-Mg) (Ω), Al 2 Cu (θ), Al 2 CuMg (S) dissolve with increasing temperature, which is likely to increase the coefficient of thermal expansion. The temperature rising induced by deformation heat varies from 2.29℃ to 38.32℃ with increasing strain rate and decreasing temperature. Three different constitutive models were calculated, evaluated and optimized, based on which, the two-step optimized Johnson-Cook model showed the highest precision. At the temperature ≤ 400 ℃, the existences of undeformable coarse phases (especially T 1 or Ω phase) promote particle stimulated nucleation (PSN), which pronouncedly increases the volume fraction of dynamic recrystallization (DRX) and decreases the flow stress. At temperature of 450℃, most of undeformable coarse phases dissolved, cutting-off mechanism of S and θ phase was observed, which is no longer beneficial to PSN, and CDRX becomes the main DRX mechanism. • Flow behavior and hot expansion behavior of the homogenized Al-Cu-Li alloy were analyzed. • Microstructures before and after compression at high temperature of the homogenized Al-Cu-Li alloy were compared. • A novel two-step optimized Johnson-Cook model with high prediction precision was proposed. • Cut-off mechanism of Al 2 CuMg phase during deformation were identified. • PSN and CDRX were characterized and the effects of precipitates on them were discussed." @default.
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- W4296641860 date "2022-12-01" @default.
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- W4296641860 title "An optimized constitutive model and microstructure characterization of a homogenized Al-Cu-Li alloy during hot deformation" @default.
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- W4296641860 doi "https://doi.org/10.1016/j.jallcom.2022.167290" @default.
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