Matches in SemOpenAlex for { <https://semopenalex.org/work/W4297920439> ?p ?o ?g. }
Showing items 1 to 75 of
75
with 100 items per page.
- W4297920439 abstract "Abstract Plasma spray – physical vapor deposition (PS-PVD) is a low pressure plasma spray technology to deposit coatings out of the vapor phase. PS-PVD is part of the family of new hybrid processes recently developed by Sulzer Metco AG (Switzerland) on the basis of the well established low pressure plasma spraying (LPPS) technology. Included in this new process family are plasma spray - chemical vapor deposition (PS-CVD) and plasma spray - thin film (PS-TF) processes. In comparison to conventional vacuum plasma spraying (VPS) and low pressure plasma spraying (LPPS), these new processes use a high energy plasma gun operated at a work pressure below 2 mbar. This leads to unconventional plasma jet characteristics which can be used to obtain specific and unique coatings. An important new feature of PS-PVD is the possibility to deposit a coating not only by melting the feed stock material which builds up a layer from liquid splats but also by vaporizing the injected material. Therefore, the PS-PVD process fills the gap between the conventional physical vapor deposition (PVD) technologies and standard thermal spray processes. The possibility to vaporize feedstock material and to produce layers out of the vapor phase results in new and unique coating microstructures. The properties of such coatings are superior to those of thermal spray and EB-PVD coatings. In contrast to EB-PVD, PS-PVD incorporates the vaporized coating material into a supersonic plasma plume. Due to the forced gas stream of the plasma jet, complex shaped parts like multi-airfoil turbine vanes can be coated homogeneously with columnar thermal barrier coatings using PS-PVD. This paper reports on the progress made by Sulzer Metco to develop a thermal spray process to produce coatings out of the vapor phase." @default.
- W4297920439 created "2022-10-01" @default.
- W4297920439 creator A5024749960 @default.
- W4297920439 creator A5064303226 @default.
- W4297920439 date "2010-05-03" @default.
- W4297920439 modified "2023-09-30" @default.
- W4297920439 title "Vapor Phase Deposition Using a Plasma Spray Process" @default.
- W4297920439 doi "https://doi.org/10.31399/asm.cp.itsc2010p0219" @default.
- W4297920439 hasPublicationYear "2010" @default.
- W4297920439 type Work @default.
- W4297920439 citedByCount "1" @default.
- W4297920439 countsByYear W42979204392013 @default.
- W4297920439 crossrefType "proceedings-article" @default.
- W4297920439 hasAuthorship W4297920439A5024749960 @default.
- W4297920439 hasAuthorship W4297920439A5064303226 @default.
- W4297920439 hasConcept C121332964 @default.
- W4297920439 hasConcept C125387068 @default.
- W4297920439 hasConcept C149669645 @default.
- W4297920439 hasConcept C151730666 @default.
- W4297920439 hasConcept C159985019 @default.
- W4297920439 hasConcept C171250308 @default.
- W4297920439 hasConcept C178790620 @default.
- W4297920439 hasConcept C185592680 @default.
- W4297920439 hasConcept C19067145 @default.
- W4297920439 hasConcept C191897082 @default.
- W4297920439 hasConcept C192562407 @default.
- W4297920439 hasConcept C195801359 @default.
- W4297920439 hasConcept C2781448156 @default.
- W4297920439 hasConcept C2816523 @default.
- W4297920439 hasConcept C38347018 @default.
- W4297920439 hasConcept C51576277 @default.
- W4297920439 hasConcept C57410435 @default.
- W4297920439 hasConcept C62520636 @default.
- W4297920439 hasConcept C64297162 @default.
- W4297920439 hasConcept C82706917 @default.
- W4297920439 hasConcept C85344455 @default.
- W4297920439 hasConcept C86803240 @default.
- W4297920439 hasConceptScore W4297920439C121332964 @default.
- W4297920439 hasConceptScore W4297920439C125387068 @default.
- W4297920439 hasConceptScore W4297920439C149669645 @default.
- W4297920439 hasConceptScore W4297920439C151730666 @default.
- W4297920439 hasConceptScore W4297920439C159985019 @default.
- W4297920439 hasConceptScore W4297920439C171250308 @default.
- W4297920439 hasConceptScore W4297920439C178790620 @default.
- W4297920439 hasConceptScore W4297920439C185592680 @default.
- W4297920439 hasConceptScore W4297920439C19067145 @default.
- W4297920439 hasConceptScore W4297920439C191897082 @default.
- W4297920439 hasConceptScore W4297920439C192562407 @default.
- W4297920439 hasConceptScore W4297920439C195801359 @default.
- W4297920439 hasConceptScore W4297920439C2781448156 @default.
- W4297920439 hasConceptScore W4297920439C2816523 @default.
- W4297920439 hasConceptScore W4297920439C38347018 @default.
- W4297920439 hasConceptScore W4297920439C51576277 @default.
- W4297920439 hasConceptScore W4297920439C57410435 @default.
- W4297920439 hasConceptScore W4297920439C62520636 @default.
- W4297920439 hasConceptScore W4297920439C64297162 @default.
- W4297920439 hasConceptScore W4297920439C82706917 @default.
- W4297920439 hasConceptScore W4297920439C85344455 @default.
- W4297920439 hasConceptScore W4297920439C86803240 @default.
- W4297920439 hasLocation W42979204391 @default.
- W4297920439 hasOpenAccess W4297920439 @default.
- W4297920439 hasPrimaryLocation W42979204391 @default.
- W4297920439 hasRelatedWork W1901401456 @default.
- W4297920439 hasRelatedWork W1975396246 @default.
- W4297920439 hasRelatedWork W2009367297 @default.
- W4297920439 hasRelatedWork W2083219062 @default.
- W4297920439 hasRelatedWork W2363117755 @default.
- W4297920439 hasRelatedWork W2890222393 @default.
- W4297920439 hasRelatedWork W3120052330 @default.
- W4297920439 hasRelatedWork W3131559899 @default.
- W4297920439 hasRelatedWork W3177905752 @default.
- W4297920439 hasRelatedWork W4297920439 @default.
- W4297920439 isParatext "false" @default.
- W4297920439 isRetracted "false" @default.
- W4297920439 workType "article" @default.