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- W4297984641 abstract "In this work a Finite Element Simulation thermal and mechanical study of a power SOT-227 package with a diamond die is performed in order to assess the impact of its mechanical properties when compared to the standard silicon dies. Furthermore, the simulations are carried using silver sintering as die-attach material, and different conditions and parameters that affect its mechanical behaviour are explained and quantified in order to illustrate the variation in results and the need for reliable modelisation and material parameters identification. Mechanical behavioural data is also extracted for the sintered silver simulating a lap shear test, which is used to validate a non-linear identification method of the Anand model parameters. The results show that the inclusion of a diamond die increases significantly the amount of stress and plastic deformation in the die-attach layer, which will lead to reliability problems and shorter life cycle. In addition, when using silver sintering as die-attach, the model parameters should be extracted for each particular material, owing to the fact that the mechanical properties of the die-attach layer strongly depend on its processing conditions. Finally, the Anand model parameter identification routine was validated, obtaining minimum deviation from the original values used to simulate the pseudo-experimental data." @default.
- W4297984641 created "2022-10-01" @default.
- W4297984641 creator A5009741194 @default.
- W4297984641 creator A5014116339 @default.
- W4297984641 creator A5033106452 @default.
- W4297984641 creator A5035526543 @default.
- W4297984641 creator A5042641818 @default.
- W4297984641 creator A5055089361 @default.
- W4297984641 creator A5088829034 @default.
- W4297984641 date "2022-08-24" @default.
- W4297984641 modified "2023-10-17" @default.
- W4297984641 title "Thermo-Mechanical Constraints for Packaging of Diamond Components" @default.
- W4297984641 cites W1499569061 @default.
- W4297984641 cites W1597734246 @default.
- W4297984641 cites W1877927675 @default.
- W4297984641 cites W1998438843 @default.
- W4297984641 cites W2038742293 @default.
- W4297984641 cites W2045760679 @default.
- W4297984641 cites W2054021075 @default.
- W4297984641 cites W2079521368 @default.
- W4297984641 cites W2086092207 @default.
- W4297984641 cites W2119418964 @default.
- W4297984641 cites W2156505933 @default.
- W4297984641 cites W2310785440 @default.
- W4297984641 cites W2483827232 @default.
- W4297984641 cites W2504206256 @default.
- W4297984641 cites W2744433778 @default.
- W4297984641 cites W2764241123 @default.
- W4297984641 cites W2777900537 @default.
- W4297984641 cites W2921770818 @default.
- W4297984641 cites W2996238279 @default.
- W4297984641 cites W3011681149 @default.
- W4297984641 cites W3046528720 @default.
- W4297984641 cites W3092074061 @default.
- W4297984641 cites W3094341251 @default.
- W4297984641 cites W4233881113 @default.
- W4297984641 doi "https://doi.org/10.1109/iwipp50752.2022.9894116" @default.
- W4297984641 hasPublicationYear "2022" @default.
- W4297984641 type Work @default.
- W4297984641 citedByCount "0" @default.
- W4297984641 crossrefType "proceedings-article" @default.
- W4297984641 hasAuthorship W4297984641A5009741194 @default.
- W4297984641 hasAuthorship W4297984641A5014116339 @default.
- W4297984641 hasAuthorship W4297984641A5033106452 @default.
- W4297984641 hasAuthorship W4297984641A5035526543 @default.
- W4297984641 hasAuthorship W4297984641A5042641818 @default.
- W4297984641 hasAuthorship W4297984641A5055089361 @default.
- W4297984641 hasAuthorship W4297984641A5088829034 @default.
- W4297984641 hasConcept C111106434 @default.
- W4297984641 hasConcept C121332964 @default.
- W4297984641 hasConcept C127413603 @default.
- W4297984641 hasConcept C135628077 @default.
- W4297984641 hasConcept C159985019 @default.
- W4297984641 hasConcept C163258240 @default.
- W4297984641 hasConcept C171250308 @default.
- W4297984641 hasConcept C192562407 @default.
- W4297984641 hasConcept C2776921476 @default.
- W4297984641 hasConcept C2777581544 @default.
- W4297984641 hasConcept C43214815 @default.
- W4297984641 hasConcept C62520636 @default.
- W4297984641 hasConcept C66938386 @default.
- W4297984641 hasConcept C78519656 @default.
- W4297984641 hasConceptScore W4297984641C111106434 @default.
- W4297984641 hasConceptScore W4297984641C121332964 @default.
- W4297984641 hasConceptScore W4297984641C127413603 @default.
- W4297984641 hasConceptScore W4297984641C135628077 @default.
- W4297984641 hasConceptScore W4297984641C159985019 @default.
- W4297984641 hasConceptScore W4297984641C163258240 @default.
- W4297984641 hasConceptScore W4297984641C171250308 @default.
- W4297984641 hasConceptScore W4297984641C192562407 @default.
- W4297984641 hasConceptScore W4297984641C2776921476 @default.
- W4297984641 hasConceptScore W4297984641C2777581544 @default.
- W4297984641 hasConceptScore W4297984641C43214815 @default.
- W4297984641 hasConceptScore W4297984641C62520636 @default.
- W4297984641 hasConceptScore W4297984641C66938386 @default.
- W4297984641 hasConceptScore W4297984641C78519656 @default.
- W4297984641 hasLocation W42979846411 @default.
- W4297984641 hasOpenAccess W4297984641 @default.
- W4297984641 hasPrimaryLocation W42979846411 @default.
- W4297984641 hasRelatedWork W1982113706 @default.
- W4297984641 hasRelatedWork W1985087230 @default.
- W4297984641 hasRelatedWork W1997927837 @default.
- W4297984641 hasRelatedWork W2029424121 @default.
- W4297984641 hasRelatedWork W2065078111 @default.
- W4297984641 hasRelatedWork W2167620349 @default.
- W4297984641 hasRelatedWork W2248418976 @default.
- W4297984641 hasRelatedWork W2356323558 @default.
- W4297984641 hasRelatedWork W2368818419 @default.
- W4297984641 hasRelatedWork W3011128213 @default.
- W4297984641 isParatext "false" @default.
- W4297984641 isRetracted "false" @default.
- W4297984641 workType "article" @default.