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- W4298049296 abstract "The challenging demands of the ATLAS High Luminosity (HL-LHC) Upgrade aim for a complete swap of new generation sensors that should cope with the ultimate radiation hardness. FBK has been one of the prime foundries to develop and fabricate such radiation-hard 3D silicon (Si) sensors. These sensors are chosen to be deployed into the innermost layer of the ATLAS Inner Tracker (ITk). Recently, a pre-production batch of 3D Si sensors of 50x50 um2 pixel geometry, compatible with the full-size ITKPix (RD53B) readout chip, was fabricated. Two wafers holding temporary metal were diced at IZM, Germany, and a systematic QC test campaign was carried out at the University of Trento electronics laboratory. The paper briefly describes the 3D Si sensor design for ATLAS ITk and the required QC characterization setups. It comprises electrical tests (i.e., I-V, C-V, and I-T) of non-irradiated RD53B sensors. In addition, the study of several parametric analyses, i.e., oxide charge density, oxide thickness, inter-pixel resistance, inter-pixel capacitance, etc., are reported with the aid of Process Control Monitor (PCM) structures." @default.
- W4298049296 created "2022-10-01" @default.
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- W4298049296 date "2022-09-26" @default.
- W4298049296 modified "2023-09-27" @default.
- W4298049296 title "Quality Control (QC) of FBK Preproduction 3D Si Sensors for ATLAS HL-LHC Upgrades" @default.
- W4298049296 doi "https://doi.org/10.48550/arxiv.2209.12991" @default.
- W4298049296 hasPublicationYear "2022" @default.
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