Matches in SemOpenAlex for { <https://semopenalex.org/work/W4300914004> ?p ?o ?g. }
- W4300914004 endingPage "298" @default.
- W4300914004 startingPage "279" @default.
- W4300914004 abstract "Abstract Plasma Immersion Ion Implantation (PIII) is a technology which is currently widely investigated as an alternative to conventional beam line implantation for ultrashallow doping beyond the 0.15 μm technology. However, there are several other application areas in modern semiconductor processing. In this paper a detailed discussion of the PIII process for semiconductors and of actual as well as future applications is given. Besides the well known advantages of PIII — fast process, implantation of the whole surface, low cost of ownership — several peculiarities — like spread of the implantation energy due to finite rise time or collisions, no mass separation, high secondary electron emission — must be mentioned. However, they can be overcome by adjusting the system and the process parameters. Considering the applications, ultrashallow junction formation by PIII is an established industrial process, whereas SIMOX and Smart‐Cut by oxygen and hydrogen implantation are current topics between research and introduction into industry. Further applications of PIII, of which some already are research topics and some are only investigated by conventional ion implantation, include seeding for metal deposition, gettering of metal impurities, etch stop layers and helium implantation for localized lifetime control." @default.
- W4300914004 created "2022-10-04" @default.
- W4300914004 creator A5045015959 @default.
- W4300914004 creator A5050273975 @default.
- W4300914004 date "2001-02-26" @default.
- W4300914004 modified "2023-09-27" @default.
- W4300914004 title "Plasma immersion ion implantation for silicon processing" @default.
- W4300914004 cites W1964003996 @default.
- W4300914004 cites W1966863561 @default.
- W4300914004 cites W1967600953 @default.
- W4300914004 cites W1969255931 @default.
- W4300914004 cites W1973186474 @default.
- W4300914004 cites W1973567406 @default.
- W4300914004 cites W1975607009 @default.
- W4300914004 cites W1977796964 @default.
- W4300914004 cites W1984153272 @default.
- W4300914004 cites W1986097983 @default.
- W4300914004 cites W1987034724 @default.
- W4300914004 cites W1990493467 @default.
- W4300914004 cites W1995865275 @default.
- W4300914004 cites W1998097934 @default.
- W4300914004 cites W1998714822 @default.
- W4300914004 cites W2000791181 @default.
- W4300914004 cites W2002673168 @default.
- W4300914004 cites W2004687893 @default.
- W4300914004 cites W2006931422 @default.
- W4300914004 cites W2008383840 @default.
- W4300914004 cites W2012810914 @default.
- W4300914004 cites W2012931921 @default.
- W4300914004 cites W2013870132 @default.
- W4300914004 cites W2019460631 @default.
- W4300914004 cites W2022624846 @default.
- W4300914004 cites W2024401213 @default.
- W4300914004 cites W2026453848 @default.
- W4300914004 cites W2028589396 @default.
- W4300914004 cites W2031195655 @default.
- W4300914004 cites W2034698592 @default.
- W4300914004 cites W2034931500 @default.
- W4300914004 cites W2035591135 @default.
- W4300914004 cites W2042306466 @default.
- W4300914004 cites W2051170226 @default.
- W4300914004 cites W2055323063 @default.
- W4300914004 cites W2055851622 @default.
- W4300914004 cites W2059570891 @default.
- W4300914004 cites W2059608997 @default.
- W4300914004 cites W2062481900 @default.
- W4300914004 cites W2066700961 @default.
- W4300914004 cites W2067408449 @default.
- W4300914004 cites W2070965406 @default.
- W4300914004 cites W2078099182 @default.
- W4300914004 cites W2078536970 @default.
- W4300914004 cites W2081023930 @default.
- W4300914004 cites W2082295299 @default.
- W4300914004 cites W2085093267 @default.
- W4300914004 cites W2086453423 @default.
- W4300914004 cites W2088911594 @default.
- W4300914004 cites W2094348145 @default.
- W4300914004 cites W2131099000 @default.
- W4300914004 cites W2132169050 @default.
- W4300914004 cites W2150377058 @default.
- W4300914004 cites W2152292903 @default.
- W4300914004 cites W2313807399 @default.
- W4300914004 cites W2324814894 @default.
- W4300914004 cites W2327391121 @default.
- W4300914004 cites W4249679525 @default.
- W4300914004 doi "https://doi.org/10.1002/andp.20015130401" @default.
- W4300914004 hasPublicationYear "2001" @default.
- W4300914004 type Work @default.
- W4300914004 citedByCount "1" @default.
- W4300914004 crossrefType "journal-article" @default.
- W4300914004 hasAuthorship W4300914004A5045015959 @default.
- W4300914004 hasAuthorship W4300914004A5050273975 @default.
- W4300914004 hasConcept C108225325 @default.
- W4300914004 hasConcept C121332964 @default.
- W4300914004 hasConcept C125099081 @default.
- W4300914004 hasConcept C145148216 @default.
- W4300914004 hasConcept C171250308 @default.
- W4300914004 hasConcept C178790620 @default.
- W4300914004 hasConcept C185592680 @default.
- W4300914004 hasConcept C192562407 @default.
- W4300914004 hasConcept C2778702798 @default.
- W4300914004 hasConcept C41823505 @default.
- W4300914004 hasConcept C49040817 @default.
- W4300914004 hasConcept C544956773 @default.
- W4300914004 hasConcept C57863236 @default.
- W4300914004 hasConcept C61696701 @default.
- W4300914004 hasConcept C62520636 @default.
- W4300914004 hasConcept C82706917 @default.
- W4300914004 hasConceptScore W4300914004C108225325 @default.
- W4300914004 hasConceptScore W4300914004C121332964 @default.
- W4300914004 hasConceptScore W4300914004C125099081 @default.
- W4300914004 hasConceptScore W4300914004C145148216 @default.
- W4300914004 hasConceptScore W4300914004C171250308 @default.
- W4300914004 hasConceptScore W4300914004C178790620 @default.
- W4300914004 hasConceptScore W4300914004C185592680 @default.
- W4300914004 hasConceptScore W4300914004C192562407 @default.
- W4300914004 hasConceptScore W4300914004C2778702798 @default.
- W4300914004 hasConceptScore W4300914004C41823505 @default.