Matches in SemOpenAlex for { <https://semopenalex.org/work/W4306967518> ?p ?o ?g. }
- W4306967518 endingPage "119503" @default.
- W4306967518 startingPage "119503" @default.
- W4306967518 abstract "• A programmable thermal test chip is designed for thermal reliability evaluations. • Uniform temperature distribution was proved by simulation and infrared thermography. • Nano-metallic sintered die-attach joints were characterized by transient dual interface method. • The junction-to-case thermal resistance of sintered structures was extracted and compared. • The in-house developed chip can accelerate the evaluation of thermal properties. The rapid development of power electronics has challenged the thermal integrity of semiconductor packaging. Further developments in this domain can be supported significantly by utilizing fast and flexible thermal characteristic evaluation. This study employs the transient dual interface method (TDIM) to characterize and compare the thermal resistance of Ag- and Cu-sintered die-attach joints using an in-house developed thermal test chip (TTC). The proposed TTC with 82.5% active area achieves a temperature sensitivity of 12 Ω/K and maximum power of 360 W per cell, which are 50% and 44% higher than the state-of-the-art, respectively. The uniformity of the temperature distribution (1 °C at 68 W) is verified by infrared thermography. The cost-effective manufacturing process allows the design to be applied to any substrate, such as SiC or GaN. Ag and Cu sintering is performed to bond the TTC on a Cu substrate, and the junction-to-case thermal resistance of the sintered structures is extracted. The lowest junction-to-case thermal resistance of 0.144 K/W is measured for the device sintered using Ag paste. Meanwhile, the Cu sintered structure exhibits a comparable value of 0.158 K/W. The proposed TTC in combination with TDIM accelerates the introduction of novel and cost-effective materials such as Cu." @default.
- W4306967518 created "2022-10-21" @default.
- W4306967518 creator A5000424567 @default.
- W4306967518 creator A5006483286 @default.
- W4306967518 creator A5009613920 @default.
- W4306967518 creator A5022656667 @default.
- W4306967518 creator A5026664536 @default.
- W4306967518 creator A5070563872 @default.
- W4306967518 date "2023-02-01" @default.
- W4306967518 modified "2023-10-16" @default.
- W4306967518 title "Transient thermal measurement on nano-metallic sintered die-attach joints using a thermal test chip" @default.
- W4306967518 cites W1534149341 @default.
- W4306967518 cites W195822438 @default.
- W4306967518 cites W1978337355 @default.
- W4306967518 cites W1980855660 @default.
- W4306967518 cites W1995350508 @default.
- W4306967518 cites W2036401331 @default.
- W4306967518 cites W2054871975 @default.
- W4306967518 cites W2091469028 @default.
- W4306967518 cites W2099648605 @default.
- W4306967518 cites W2108776657 @default.
- W4306967518 cites W2115192633 @default.
- W4306967518 cites W2118672835 @default.
- W4306967518 cites W2133314170 @default.
- W4306967518 cites W2139282333 @default.
- W4306967518 cites W2150328878 @default.
- W4306967518 cites W2150705456 @default.
- W4306967518 cites W2165352515 @default.
- W4306967518 cites W2169346090 @default.
- W4306967518 cites W2170705682 @default.
- W4306967518 cites W2291936357 @default.
- W4306967518 cites W2558815003 @default.
- W4306967518 cites W2562061939 @default.
- W4306967518 cites W2581620852 @default.
- W4306967518 cites W2754799743 @default.
- W4306967518 cites W2769956975 @default.
- W4306967518 cites W2783063272 @default.
- W4306967518 cites W2808534672 @default.
- W4306967518 cites W2901801108 @default.
- W4306967518 cites W2903477511 @default.
- W4306967518 cites W2915502460 @default.
- W4306967518 cites W2999550980 @default.
- W4306967518 cites W3036071617 @default.
- W4306967518 cites W3082298071 @default.
- W4306967518 cites W3120346419 @default.
- W4306967518 cites W3199327937 @default.
- W4306967518 cites W3209169625 @default.
- W4306967518 doi "https://doi.org/10.1016/j.applthermaleng.2022.119503" @default.
- W4306967518 hasPublicationYear "2023" @default.
- W4306967518 type Work @default.
- W4306967518 citedByCount "3" @default.
- W4306967518 countsByYear W43069675182023 @default.
- W4306967518 crossrefType "journal-article" @default.
- W4306967518 hasAuthorship W4306967518A5000424567 @default.
- W4306967518 hasAuthorship W4306967518A5006483286 @default.
- W4306967518 hasAuthorship W4306967518A5009613920 @default.
- W4306967518 hasAuthorship W4306967518A5022656667 @default.
- W4306967518 hasAuthorship W4306967518A5026664536 @default.
- W4306967518 hasAuthorship W4306967518A5070563872 @default.
- W4306967518 hasConcept C111106434 @default.
- W4306967518 hasConcept C111919701 @default.
- W4306967518 hasConcept C119599485 @default.
- W4306967518 hasConcept C121332964 @default.
- W4306967518 hasConcept C127413603 @default.
- W4306967518 hasConcept C153294291 @default.
- W4306967518 hasConcept C159985019 @default.
- W4306967518 hasConcept C165005293 @default.
- W4306967518 hasConcept C171250308 @default.
- W4306967518 hasConcept C191897082 @default.
- W4306967518 hasConcept C192562407 @default.
- W4306967518 hasConcept C204530211 @default.
- W4306967518 hasConcept C2780357685 @default.
- W4306967518 hasConcept C2780799671 @default.
- W4306967518 hasConcept C41008148 @default.
- W4306967518 hasConcept C544153396 @default.
- W4306967518 hasConceptScore W4306967518C111106434 @default.
- W4306967518 hasConceptScore W4306967518C111919701 @default.
- W4306967518 hasConceptScore W4306967518C119599485 @default.
- W4306967518 hasConceptScore W4306967518C121332964 @default.
- W4306967518 hasConceptScore W4306967518C127413603 @default.
- W4306967518 hasConceptScore W4306967518C153294291 @default.
- W4306967518 hasConceptScore W4306967518C159985019 @default.
- W4306967518 hasConceptScore W4306967518C165005293 @default.
- W4306967518 hasConceptScore W4306967518C171250308 @default.
- W4306967518 hasConceptScore W4306967518C191897082 @default.
- W4306967518 hasConceptScore W4306967518C192562407 @default.
- W4306967518 hasConceptScore W4306967518C204530211 @default.
- W4306967518 hasConceptScore W4306967518C2780357685 @default.
- W4306967518 hasConceptScore W4306967518C2780799671 @default.
- W4306967518 hasConceptScore W4306967518C41008148 @default.
- W4306967518 hasConceptScore W4306967518C544153396 @default.
- W4306967518 hasLocation W43069675181 @default.
- W4306967518 hasOpenAccess W4306967518 @default.
- W4306967518 hasPrimaryLocation W43069675181 @default.
- W4306967518 hasRelatedWork W1982394651 @default.
- W4306967518 hasRelatedWork W1994103032 @default.
- W4306967518 hasRelatedWork W2015102462 @default.
- W4306967518 hasRelatedWork W2051270029 @default.