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• W4307689871 endingPage "42944" @default.
• W4307689871 startingPage "42944" @default.
• W4307689871 abstract "Laser direct writing (LDW) is a promising candidate for the fabrication of all-dielectric THz absorbers for its high flexibility and material compatibility. However, multi-step processing or multi-layer materials are required to compensate for the nonideal features of LDW to realize good absorption performance. To further explore the potential of LDW in flexible and cost-effective THz absorber fabrication, in this work, we demonstrate a design method of THz absorbers fully considering and utilizing the characteristics of laser processing. Specifically, we first numerically analyze that by properly combining basic structures processed by single-step LDW, good and adjustable absorption performance can be achieved on a single-layer substrate. Then we experimentally fabricate THz absorbers by processing periodic composite structures, which are combined by grooves and circular holes, on single-layer doped silicon using LDW. Experimental results show that our method can fabricate THz absorbers at a speed of 3.3 mm2/min with an absorptivity above 90% over a broadband of 1.8-3 THz. Our method provides a promising solution for the flexible and efficient fabrication of all-dielectric broadband THz absorbers." @default.
• W4307689871 created "2022-11-05" @default.
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• W4307689871 date "2022-11-08" @default.
• W4307689871 modified "2023-10-14" @default.
• W4307689871 title "Flexible and efficient fabrication of a terahertz absorber by single-step laser direct writing" @default.
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• W4307689871 doi "https://doi.org/10.1364/oe.468753" @default.
• W4307689871 hasPubMedId "https://pubmed.ncbi.nlm.nih.gov/36523004" @default.
• W4307689871 hasPublicationYear "2022" @default.
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