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- W4308702486 abstract "EUV lithography is currently being used in semiconductor high volume manufacturing, however, performing non-destructive metrology at the nanoscale for different types of structures and materials is still an extremely challenging task. The EUV reflective grazing incidence nanoscope (REGINE) is a new synchrotron end-station dedicated to non-destructive EUV metrology at the nanoscale for surface/layered structures with different material compositions. REGINE is being developed at the Swiss Light Source synchrotron and aims to enable grazing-incidence coherent diffraction imaging (CDI), scatterometry, and reflectometry in the energy range of 80 to 200 eV. In this work, we present the concept of the REGINE tool and the results of its commissioning experiments." @default.
- W4308702486 created "2022-11-14" @default.
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- W4308702486 date "2022-12-01" @default.
- W4308702486 modified "2023-10-18" @default.
- W4308702486 title "Reflective grazing incidence EUV nanoscope for wafer metrology" @default.
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- W4308702486 doi "https://doi.org/10.1117/12.2641776" @default.
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