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• W4310187908 endingPage "116499" @default.
• W4310187908 startingPage "116499" @default.
• W4310187908 abstract "As the enhanced acceleration performance of electric vehicles demands improved mileage capabilities, 3D packaging is a promising solution for developing high-power-density SiC power modules. However, 3D packaging causes instability owing to the increased heat flux and heat dissipation inside the power module. Thus, this paper proposes an ultra-thermostable embedded liquid cooling strategy for the thermal management of SiC 3D packaging power modules in electric vehicles. We constructed an embedded micro pin–fin (E-MPF) with non-uniform density in the SiC substrate to mount the SiC Schottky barrier diodes (SBDs). The thermostability and temperature uniformity of the SiC 3D packaging power modules containing E-MPF SiC and direct bond copper (DBC) substrates were verified. The results revealed that the SiC SBDs mounted on the E-MPF SiC substrate could stably operate up to a total power dissipation of 320 W at a 100 mL/min coolant (water) flow rate, whereas those attached on the DBC substrate could be operated only under 144 W (operation terminated at a maximum junction temperature of 175 ℃). Furthermore, the junction-to-coolant thermal resistance of the E-MPF SiC substrate could be reduced by 78.89 % compared to that of the DBC substrate. Moreover, the prepared 3D stacking package effectively improved the temperature uniformity of the SiC power modules by 68.69 %. The presented ultra-thermostable E-MPF substrate SiC power module can steadily render a motor torque elevation that is one magnitude greater than that required for sustaining the boiling-free condition on the DBC substrate. This embedded liquid-cooling architecture affords a feasible solution for the thermal management of upcoming high-power electric vehicle SiC inverters." @default.
• W4310187908 created "2022-11-30" @default.
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• W4310187908 date "2023-01-01" @default.
• W4310187908 modified "2023-10-16" @default.
• W4310187908 title "Ultra-thermostable embedded liquid cooling in SiC 3D packaging power modules of electric vehicles" @default.
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• W4310187908 doi "https://doi.org/10.1016/j.enconman.2022.116499" @default.
• W4310187908 hasPublicationYear "2023" @default.
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