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- W4310279743 abstract "respectively, for Sn/Pb eutectic. Alloys with 8 to 10 wt.% lead showed contact angles and areas of spread similar to Sn/Pb eutectic under similar conditions. The best results on the as-received substrates, compared to the Sn/Pb eutectic, were obtained from the Sn/Ag eutectic with 10 wt.% lead. The very low-lead (less than 10 wt.% lead) and lead-free alloys, however, failed to achieve the performance level of eutectic Sn/Pb solders. A desire to improve the spreading of very low-lead and lead-free solders provided the impetus for these efforts to produce {open_quotes}engineered{close_quotes} rough surfaces. In an attempt to improve the wettability and spreading behavior of very low-lead and lead-free alloys, the very low-lead and lead-free members of the Sn/Ag system were tested on roughened copper-clad FR-4. Every alloy in the test suite demonstrated improvement in area of spread on the roughened substrates. The best results on the roughened substrates, compared to the Sn/Pb eutectic, were obtained from the Sn/Ag eutectic with 8 wt.% lead. The effects of surface roughness on the wettability and flow behavior of solder alloys has provided insight into surface morphologies that lead to improved solderability." @default.
- W4310279743 created "2022-11-30" @default.
- W4310279743 creator A5060599407 @default.
- W4310279743 date "2021-09-01" @default.
- W4310279743 modified "2023-09-26" @default.
- W4310279743 title "Solderability of Additive Copper Surfaces." @default.
- W4310279743 doi "https://doi.org/10.2172/1888387" @default.
- W4310279743 hasPublicationYear "2021" @default.
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