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- W4310717051 abstract "Due to its low cost, the Cu/Sn/Ni microbump is the most widely used structure in electronic packaging. Recent studies have characterized the evolution of the microstructure and phase formation in this system, and a unique (Cu,Ni) <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> phase has been discovered with a high Ni content. However, there has been debate over the formation mechanism of this phase. This study builds a model of the formation mechanism of (Cu,Ni) <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>6</inf> Sn <inf xmlns:mml=http://www.w3.org/1998/Math/MathML xmlns:xlink=http://www.w3.org/1999/xlink>5</inf> and provides direct proof." @default.
- W4310717051 created "2022-12-16" @default.
- W4310717051 creator A5037027565 @default.
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- W4310717051 date "2022-10-28" @default.
- W4310717051 modified "2023-09-28" @default.
- W4310717051 title "Formation Mechanism of high Ni content (Cu, Ni)<sub>6</sub>Sn<sub>5</sub> in Cu/Sn/Ni microbump for solid state aging" @default.
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- W4310717051 doi "https://doi.org/10.1109/icta56932.2022.9962977" @default.
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