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• W4311746274 endingPage "112573" @default.
• W4311746274 startingPage "112573" @default.
• W4311746274 abstract "Brazing Ti3SiC2 ceramic to pure copper can expand their practical applications, but excessive brittle intermetallic in the joint is harmful to mechanical properties of joint. The key to acquire a high-quality brazed joint is to control the microstructure in brazing seam and diffusion reaction zone at Ti3SiC2 ceramic side. Herein, Sn6Ag7Ni4Co2Ti low-melting high entropy alloy was fabricated and brazed to acquire a defect-free Ti3SiC2/Cu brazed joint. Through careful characterizations of the interfacial reaction products, the influence of novel HEA filler was clarified. The high-entropy effect and hysteresis effect of HEA filler effectively reduced the rate of atomic, and metallurgical reaction was also slowed down, which is beneficial to maintain a simple interface structure. The interface of Ti3SiC2/Cu joint brazed with Sn6Ag7Ni4Co2Ti HEA filler is mainly composed of Ag (s, s), Cu (s, s), Cu3Sn and FCC-base solid solution. Due to the thin diffusion reaction zone and solid solution, the maximum shear strength of 60.55 ± 3.45 MPa was achieved when the joint was brazed at 1000 °C for 10 min. This is 34.85% more than the joint brazed with Ag-26.7Cu-4.5Ti filler under its optimal brazing parameter." @default.
• W4311746274 created "2022-12-28" @default.
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• W4311746274 date "2023-02-01" @default.
• W4311746274 modified "2023-09-30" @default.
• W4311746274 title "Designing a low-melting Sn6Ag7Ni4Co2Ti high entropy alloy filler to optimize microstructure and mechanical properties of Ti3SiC2/Cu joint" @default.
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• W4311746274 doi "https://doi.org/10.1016/j.matchar.2022.112573" @default.
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