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- W4311761013 abstract "Fused silica is widely used in precision optical devices for its excellent optical properties. However, it has hard and brittle nature, becoming a difficult-to-process material. This makes microscopic cracks left on the processed surface of silica induced by traditional mechanical processing methods. In this regard, it is a challenge to achieve an atomic-scale surface on silica. To overcome this challenge, nanometer CeO2 abrasives with uniform shape and size were prepared via a hydrothermal method. A novel chemical mechanical polishing (CMP) slurry is developed using the prepared CeO2 abrasives, Na2CO3 and deionized water, which is low-cost, non-toxic, and environmentally friendly. The surface roughness, Sa of fused silica after CMP is 0.093 nm with a scanning area of 20 × 20 μm2. To the best of our knowledge, it is the lowest surface roughness on silica after CMP. The CMP mechanism was investigated by X-ray photoelectron spectroscopy and infrared Fourier transformation. Under alkaline conditions, the abrasives interacted with the silica forming a CeOSi reaction product, through a chemical tooth action, which is significant to produce an atomic-scale surface on silica. These findings provide a new pathway to fabricate atomic-scale surface for a hard-brittle solid." @default.
- W4311761013 created "2022-12-28" @default.
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- W4311761013 date "2023-01-01" @default.
- W4311761013 modified "2023-10-11" @default.
- W4311761013 title "Atomic-scale surface of fused silica induced by chemical mechanical polishing with controlled size spherical ceria abrasives" @default.
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- W4311761013 doi "https://doi.org/10.1016/j.jmapro.2022.12.008" @default.
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