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- W4312266965 abstract "In this study, we evaluate yield and reliability for a smart power device fabricated in 0.35 μm technology. The wire bonds are formed with 50.8 micron (2 mil) diameter Pd-coated Cu wire. For a conventional wire bond process, there is a risk of damage to interconnect layers under the bond pads, resulting in yield loss and reliability failures. In contrast, by using a segmented wire bond process, the yield loss associated with bond pad damage is eliminated and highly reliable wire bond connections are achieved." @default.
- W4312266965 created "2023-01-04" @default.
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- W4312266965 date "2022-07-18" @default.
- W4312266965 modified "2023-09-27" @default.
- W4312266965 title "Reliability of Power Devices with Copper Wire Bond" @default.
- W4312266965 doi "https://doi.org/10.1109/ipfa55383.2022.9915763" @default.
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