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- W4312720838 abstract "The chip precision bonding operation is a large-stroke high-speed and high-acceleration operation, which is usually realized by a voice-coil-motor (VCM). During the decelerating positioning to contact the chip, such high-dynamic movement could often be accompanied by inertial vibration which may impact the chip. To achieve a gentle contacting, the VCM soft-landing method is widely used in the bonding process, which designs a micro-searching-area to accommodate the inertial vibration, and starts up a low-speed uniform motion once the bonding system stabilizes. To minimize the time consumed in the searching area, this work proposed a high-efficiency searching time reduction (HSTR) method. Specifically, during the entire inertial vibration, a dynamic uniform motion actuation, which is conditionally planned for the VCM, starts the uniform motion as early as possible, and arrives at the target position precisely when the vibration attenuation is completed. The start-up moment planning is determined by the inertial vibration cycle, while the actuation velocity planning is dynamically decided by the real-time inertial vibration energy. The HSTR method can perform a proper actuation to speed up the VCM soft-landing without affecting the gentle contacting. Together with theoretical verification of its implementation and effectiveness simulation, the HSTR method is validated experimentally with different displacements, velocities, and accelerations." @default.
- W4312720838 created "2023-01-05" @default.
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- W4312720838 date "2023-09-01" @default.
- W4312720838 modified "2023-10-17" @default.
- W4312720838 title "A High-Efficiency Searching Time Reduction Method for VCM Soft-Landing Operation During Chip Bonding" @default.
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- W4312720838 doi "https://doi.org/10.1109/tie.2022.3210553" @default.
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