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- W4312855662 abstract "Power insulation equipment needs to work in high temperature environment for a long time. With the increase of power level, higher requirements are put forward for heat resistance of insulation materials such as basin-type insulator. To explore the effect of the method of curing agent compounding on the heat resistance of epoxy resin curing products, this paper mixed hexahydrophthalic anhydride (HHPA) and tetrahydrophthalic anhydride (THPA) to obtain epoxy resin curing products with different curing agent ratios. The heat resistance was tested, and the molecular simulation was carried out by Materials Studio(MS). The test results show that after compounding the curing agent, the glass transition temperature of the epoxy resin compound tested by DSC method is up to 10.51% higher than that before compounding, the results of DMA test and molecular dynamics (MD) simulation also have similar conclusions; However, the thermal decomposition temperature of epoxy resin composites under the compound curing agent has dropped significantly. In this paper, the mechanism is analyzed from the perspective of chemical bonds of different curing agents, and the influence mechanism of curing agent compounding method on the heat resistance of epoxy resin composites is studied, which has certain reference value for the use of compound curing agent in power equipment." @default.
- W4312855662 created "2023-01-05" @default.
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- W4312855662 date "2022-09-25" @default.
- W4312855662 modified "2023-09-29" @default.
- W4312855662 title "Effect of Curing Agent Compounding on Heat Resistance of Epoxy Resin Composites" @default.
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- W4312855662 doi "https://doi.org/10.1109/ichve53725.2022.9961710" @default.
- W4312855662 hasPublicationYear "2022" @default.
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