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- W4312972522 abstract "Thermoreflectance (TR) imaging for thermographic purposes in thermal characterisation and failure analysis is becoming a technique with increasing performance, relevance, and fields of application despite the small scale of the effect and the consequently compulsory requirements for lock-in amplification. Whereas a classical benchmark case for TR imaging are structures in the range between the spatial resolution limit of optical and infrared (IR) wavelength devices (as e.g. HEMT-structures), there is a lot of potential to use it for failure analytical purposes with more relaxed requirements on absolute measurement values. We show the performance, and limits of the TR technique. Using defective devices such as GaN HEMT and power MOSFET, both showing gate-source leakage currents, we demonstrate IR and TR techniques in direct comparison. In addition, SEM images and FIB cross sections were made to show the real, defect in high resolution. TR always located the defect correctly, whereas IR was for some cases only able to find the defect correctly with invasive coating on the sample." @default.
- W4312972522 created "2023-01-05" @default.
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- W4312972522 date "2022-09-28" @default.
- W4312972522 modified "2023-09-26" @default.
- W4312972522 title "Failure Analysis by Infrared and Thermoreflectance Imaging Applied on Active Devices" @default.
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- W4312972522 doi "https://doi.org/10.1109/therminic57263.2022.9950653" @default.
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