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• W4313307495 abstract "The growth in modern micro or nano electronic chips and electrical devices in the market, with the aim for developing a highly efficient processing machine. However, heat dissipation is a critical problem for these electrical and electronic devices. The heat extraction from these devices can be enhanced by adding thermal conductive epoxy paste over the surface. The epoxy polymer use has been increasing widely in the electrical and electronic application due to its lightweight, exceptional insulating, adhesives nature and low corrosion rate. In the present work, an initial attempt is made to utilize the waste crystalized natural bamboo filler which will help to minimize the cost, energy and environmental damage. Each year a large amount of bamboo dust is produced from the bamboo product-based processing industries. The micro-sized crystalized bamboo filler and graphite allotrope based conductive fillers with varied weight percentage is used for developing a thermal conductive paste. The filler-based hybrid conductive paste is developed from chemically treated crystalized bamboo filler, graphite and graphene nanoplatelets of different weight percentages. The preparation of hybrid conductive paste is divided into three cases. Case1: varied micro crystalized bamboo filler weight percentage and Graphene nanoplatelet (GNP) filler are made constant with 0.1 wt. %. Case2: varied GNP filler weight percentage varied and the treated micro crystalized bamboo filler are made constant with 5 wt. %. Case3: Graphite (GrP) filler is made constant with 1 wt. % and varied treated micro crystalized bamboo filler weight percentage of respectively. After solidification of these conductive epoxy paste, its thermal conductive behavior is examined using third-generation advance modified transient plane source technique. To investigate the formation of the conductive path in the epoxy polymer scanning electron microscope. Corrosion analyzer is used to determine the reduction in the corrosion rate." @default.
• W4313307495 created "2023-01-06" @default.
• W4313307495 creator A5038784711 @default.
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• W4313307495 date "2022-11-16" @default.
• W4313307495 modified "2023-09-27" @default.
• W4313307495 title "Development of thermal conductive paste for enhancing the heat transfer rate in electrical and electronic devices" @default.
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• W4313307495 doi "https://doi.org/10.1109/iceccme55909.2022.9988142" @default.
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