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- W4313407233 abstract "Design, fabrication, and characterization of close-packed field emitter tips enclosed in an Si trench and stand-alone arrays are presented. The two types of field emitter arrays (FEAs) are fabricated using a combination of high-throughput electron-beam lithography, plasma etching, and anode bonding integration technology. The field emitter array inside the trench shows a higher turn-on voltage compared to the stand-alone array. Without any tip sharpening, a current of 7.5 [Formula: see text]A was observed at 300 V from FEAs inside the trench, while a higher current of 12.5 [Formula: see text]A was observed at the same voltage for the stand-alone array." @default.
- W4313407233 created "2023-01-06" @default.
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- W4313407233 date "2023-01-01" @default.
- W4313407233 modified "2023-10-16" @default.
- W4313407233 title "Close-packed silicon field emitter arrays with integrated anode fabricated by electron-beam lithography" @default.
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- W4313407233 doi "https://doi.org/10.1116/6.0002295" @default.
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