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- W4313462589 abstract "Practical adhesion of dissimilar materials is affected by surface/interface chemistry, surface roughness, and the properties of the materials making the interface. In this paper, TiW peel adhesion (practical adhesion) to pyromellitic dianhydride-oxydianiline (PMDA-ODA) polyimide (PI) has been investigated with the focus on surface and interface chemistry. The PI was exposed to tetramethylammonium hydroxide (TMAH) prior to cure followed by Ar-sputtering with and without prior exposure to CF4-reactive ion etch (RIE). PI surface chemistry was characterized before and after plasma modifications using X-ray photoelectron spectroscopy (XPS). TiW/PI peel adhesion improved greatly with Ar-sputter treatment of the PI, while adding a CF4-RIE step prior to Ar-sputtering had no significant effect. The results show that an increase in peel adhesion is not directly correlated only to changes in surface or interface chemistry. Other explanations for increased peel adhesion are discussed." @default.
- W4313462589 created "2023-01-06" @default.
- W4313462589 creator A5087179999 @default.
- W4313462589 date "2023-01-03" @default.
- W4313462589 modified "2023-10-16" @default.
- W4313462589 title "TiW adhesion to PMDA-ODA polyimide. Surface and interface chemistry" @default.
- W4313462589 doi "https://doi.org/10.1201/9780429070297-13" @default.
- W4313462589 hasPublicationYear "2023" @default.
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