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- W4315749916 abstract "Technological progress encourages the development of more versatile electronic devices with reduced size at an increasing rate. Thermosets epoxy is a popularly preferred adhesive material in the packaging of electronic devices. Adhesives are capable of operating continuously at elevated temperatures and are generally used in electronics, automotive, and aerospace. It is necessary to predict the epoxy composite's life in these high-temperature applications indicating their thermal management and limitations to avoid malfunctioning. Graphene (G) and Polyaniline (PA) nanofillers with bisphenol-A resin had prepared by polymerization with different weight ratios to enhance the thermal properties of the fabricated material. The heating rate effects of the synthesized composites had examined by differential scanning calorimetry (DSC). A study had conducted using DSC data to calculate the specific heat capacities of the composites. Thermal diffusivity, thermal conductivity, and thermal stability of EGPA3 hybrid composites reached a maximum value of 3.18 W/mK, 339 °C, and 0.396 × 10−6 m2/s, respectively. These led to a decrease in the thermal expansion coefficient making EGPA good thermal conductive material." @default.
- W4315749916 created "2023-01-13" @default.
- W4315749916 creator A5072864643 @default.
- W4315749916 creator A5085425444 @default.
- W4315749916 date "2023-01-01" @default.
- W4315749916 modified "2023-10-03" @default.
- W4315749916 title "Thermal properties of epoxy composites with polyaniline and graphene nanofiller" @default.
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- W4315749916 doi "https://doi.org/10.1016/j.matpr.2022.12.272" @default.
- W4315749916 hasPublicationYear "2023" @default.
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