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• W4317103708 endingPage "1419" @default.
• W4317103708 startingPage "1405" @default.
• W4317103708 abstract "Abstract Monodisperse polystyrene‐silver (PS‐Ag) composite microspheres were used to enhance the electrical conductivity of epoxy resin‐based anisotropic conductive adhesives (ACAs). Specially designed PS‐Ag composite microspheres were used as conductive elements to construct anisotropic conductive arrays. In addition, the surface microstructure and morphology of PS‐Ag composite microspheres were controlled by adjusting the silver precursor concentration and implemented electroless plating method. The size and conductivity of the final composite microspheres used for ACAs were 2.572 μm and 81,967 S cm −1 , respectively. In addition, diglycidyl ether of bisphenol‐A (DGEBA) epoxy resin and polyamide resin were used as the matrix resin and curing agent, respectively, to predict the optimum curing process parameters based on curing kinetics. Based on this premise, carboxyl‐terminated butadiene‐acrylonitrile (CTBN) and PS‐Ag composite microspheres were used as the toughening agent and conductive filler, respectively, and a facile strategy was developed to prepare ACAs (viz., PS‐Ag/Ep‐ACAs). As the PS‐Ag composite microspheres exhibited a submicron structure, PS‐Ag/Ep‐ACAs creatively exhibited satisfactory anisotropic electrical and mechanical properties. Therefore, the research strategy and fabrication methods proposed demonstrate immense potential for the fabrication of large‐scale ACAs in practical applications." @default.
• W4317103708 created "2023-01-18" @default.
• W4317103708 creator A5000420174 @default.
• W4317103708 creator A5009095737 @default.
• W4317103708 creator A5062987450 @default.
• W4317103708 creator A5069001945 @default.
• W4317103708 date "2023-01-17" @default.
• W4317103708 modified "2023-10-02" @default.
• W4317103708 title "Shell structure control of monodisperse <scp>polystyrene‐silver</scp> composite microspheres and synthesis of epoxy <scp>resin‐based</scp> anisotropic conductive adhesives" @default.
• W4317103708 cites W1582689108 @default.
• W4317103708 cites W1884609290 @default.
• W4317103708 cites W1975059132 @default.
• W4317103708 cites W1984652929 @default.
• W4317103708 cites W2001491139 @default.
• W4317103708 cites W2010883406 @default.
• W4317103708 cites W2022594890 @default.
• W4317103708 cites W2029290117 @default.
• W4317103708 cites W2037398945 @default.
• W4317103708 cites W2042188926 @default.
• W4317103708 cites W2047198130 @default.
• W4317103708 cites W2050539965 @default.
• W4317103708 cites W2062248124 @default.
• W4317103708 cites W2067781728 @default.
• W4317103708 cites W2069468262 @default.
• W4317103708 cites W2070298731 @default.
• W4317103708 cites W2080045187 @default.
• W4317103708 cites W2082894305 @default.
• W4317103708 cites W2083107725 @default.
• W4317103708 cites W2088984112 @default.
• W4317103708 cites W2091347185 @default.
• W4317103708 cites W2105964042 @default.
• W4317103708 cites W2133447552 @default.
• W4317103708 cites W2615339880 @default.
• W4317103708 cites W2775073868 @default.
• W4317103708 cites W2789300003 @default.
• W4317103708 cites W2899794145 @default.
• W4317103708 cites W2901133930 @default.
• W4317103708 cites W2906684230 @default.
• W4317103708 cites W2919131076 @default.
• W4317103708 cites W2921086999 @default.
• W4317103708 cites W2978387780 @default.
• W4317103708 cites W3012448282 @default.
• W4317103708 cites W3036298941 @default.
• W4317103708 cites W3119350649 @default.
• W4317103708 cites W3155441676 @default.
• W4317103708 cites W3185878587 @default.
• W4317103708 cites W3187398107 @default.
• W4317103708 cites W3206597269 @default.
• W4317103708 cites W4200066846 @default.
• W4317103708 cites W4207019278 @default.
• W4317103708 cites W4210312269 @default.
• W4317103708 cites W4221040422 @default.
• W4317103708 cites W4224231054 @default.
• W4317103708 cites W4280566395 @default.
• W4317103708 cites W4281643710 @default.
• W4317103708 cites W4281911069 @default.
• W4317103708 cites W4282004273 @default.
• W4317103708 cites W4282926493 @default.
• W4317103708 cites W4292202357 @default.
• W4317103708 cites W4292461598 @default.
• W4317103708 cites W4293791458 @default.
• W4317103708 cites W4296838023 @default.
• W4317103708 doi "https://doi.org/10.1002/pat.5979" @default.
• W4317103708 hasPublicationYear "2023" @default.
• W4317103708 type Work @default.
• W4317103708 citedByCount "0" @default.
• W4317103708 crossrefType "journal-article" @default.
• W4317103708 hasAuthorship W4317103708A5000420174 @default.
• W4317103708 hasAuthorship W4317103708A5009095737 @default.
• W4317103708 hasAuthorship W4317103708A5062987450 @default.
• W4317103708 hasAuthorship W4317103708A5069001945 @default.
• W4317103708 hasConcept C104779481 @default.
• W4317103708 hasConcept C11432220 @default.
• W4317103708 hasConcept C132976073 @default.
• W4317103708 hasConcept C136525101 @default.
• W4317103708 hasConcept C142724271 @default.
• W4317103708 hasConcept C159985019 @default.
• W4317103708 hasConcept C166595027 @default.
• W4317103708 hasConcept C188027245 @default.
• W4317103708 hasConcept C192562407 @default.
• W4317103708 hasConcept C204787440 @default.
• W4317103708 hasConcept C2777922577 @default.
• W4317103708 hasConcept C2779227376 @default.
• W4317103708 hasConcept C521977710 @default.
• W4317103708 hasConcept C68928338 @default.
• W4317103708 hasConcept C71924100 @default.
• W4317103708 hasConceptScore W4317103708C104779481 @default.
• W4317103708 hasConceptScore W4317103708C11432220 @default.
• W4317103708 hasConceptScore W4317103708C132976073 @default.
• W4317103708 hasConceptScore W4317103708C136525101 @default.
• W4317103708 hasConceptScore W4317103708C142724271 @default.
• W4317103708 hasConceptScore W4317103708C159985019 @default.
• W4317103708 hasConceptScore W4317103708C166595027 @default.
• W4317103708 hasConceptScore W4317103708C188027245 @default.
• W4317103708 hasConceptScore W4317103708C192562407 @default.
• W4317103708 hasConceptScore W4317103708C204787440 @default.
• W4317103708 hasConceptScore W4317103708C2777922577 @default.
• W4317103708 hasConceptScore W4317103708C2779227376 @default.

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